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Historical Milestones

2012

Month Description
June 2012 Rambus names Ronald Black as President and Chief Executive Officer
May 2012 Rambus and Cooper Lighting sign license agreement for Rambus' patented lighting innovations
April 2012 Rambus and Fern Howard sign license agreement for Rambus' patented lighting innovations
March 2012 Rambus and MediaTek sign patent license agreement
February 2012 Rambus and NVIDIA sign patent license agreement
February 2012 Rambus acquires Unity Semiconductor
January 2012 Rambus' Cryptography Research and CPU Tech sign patent license agreement for differential power analysis countermeasures

2011

Month Description
December 2011 Rambus and Broadcom sign patent license agreement
December 2011 Rambus' Cryptography Research and INVIA SAS sign developer agreement for differential power analysis countermeasures
December 2011 Rambus and ITRI collaborate to develop interconnect and advanced 3D packaging technologies
November 2011 Rambus' Cryptography Research and Mikron JSC sign patent license agreement for differential power analysis countermeasures
September 2011 Trident Microsystems selects CryptoFirewall™ security technology from Rambus' Cryptography Research for pay TV security
September 2011 Rambus' Cryptography Research and MStar Semiconductor sign license agreement for Cryptography Research's CryptoFirewall™ security technology
September 2011 Rambus' Cryptography Research and Verimatrix sign license agreement for Cryptography Research's CryptoFirewall™ security technology
June 2011 Rambus acquires Cryptography Research
June 2011 Rambus and Freescale sign patent license agreement
May 2011 Rambus introduces its advanced lighting solutions
March 2011 Toshiba renews patent license agreement with Rambus
January 2011 Panasonic renews patent license agreement with Rambus
January 2011 Rambus acquires the lighting and display portfolio of patents and technology from Imagine Designs

2010

Month Description
December 2010 Renesas renews patent license agreement with Rambus
December 2010 Elpida renews patent license agreement with Rambus
August 2010 Rambus and NVIDIA sign patent license agreement
July 2010 Rambus reaches 1000th patent milestone
June 2010 GE Lighting and Rambus sign license agreement to create LED lighting solutions for global markets
March 2010 AMD renews patent license agreement with Rambus
February 2010 Rambus introduces Mobile XDR™ memory for next-generation mobile devices
January 2010 Rambus and Samsung Electronics sign comprehensive licensing agreement

2009

Month Description
December 2009 Rambus acquires a portfolio of lighting and optoelectronics patents and technology from Global Lighting Technologies Inc.
October 2009 Rambus Fellow, Craig Hampel, named Inventor of the Year by the Silicon Valley Intellectual Property Law Association
June 2009 XDR™ DRAM surpasses 100 million units shipped
May 2009 Rambus unveils a set of innovations that can advance computing main memory beyond current DDR3 data rate limits
April 2009 Rambus aquires patents from Inapac to broaden its offerings for the mobile memory market
February 2009 Rambus announces Mobile Memory Initiative to achieve a high-bandwidth, low-power memory interface solution for next-generation mobile devices

2008

Month Description
July 2008 Rambus and Qimonda sign amended patent license agreement
March 2008 Industry ships 50 million XDR™ DRAM memory devices
February 2008 Rambus XDR™ Memory Architecture named 2008 DesignVision winner

2007

Month Description
December 2007 Toshiba licenses Rambus XDR™ Memory Architecture for HDTV chipset
November 2007 Rambus launches Terabyte Bandwidth Initiative
June 2007 Rambus XDR™ memory architecture adopted in Texas Instruments DLP projector
June 2007 Industry ships 25 million XDR™ DRAM memory devices
January 2007 Rambus and Spansion sign patent license agreement
January 2007 Qimonda and Rambus sign technology license for XDR™ DRAM

2006

Month Description
November 2006 Rambus technology is adopted in the PlayStation®3 computer entertainment system
October 2006 Toshiba licenses Rambus XDR™ memory and PCI Express interface solutions
September 2006 Rambus launches Gen2 Total Solution designed for PCI Express
June 2006 Rambus reaches 500th issued patent milestone
March 2006 Rambus signs patent license agreement with Fujitsu, covering semiconductors and systems
January 2006 Rambus signs patent license agreement with AMD

2005

Month Description
September 2005 Rambus signs patent license agreement with Renesas Technology Corp.
July 2005 Rambus introduces next-generation XDR™2 DRAM offering unprecedented graphics performance
June 2005 Rambus signs new technology license agreement with IBM
May 2005 Rambus reaches 400th issued patent milestone
May 2005 Rambus XDR™ and FlexIO™ revealed as key interface technologies in Sony Computer Entertainment's PlayStation®3
May 2005 Dr. Mark Horowitz named as Rambus Chief Scientist
April 2005 Rambus acquires digital core IP from GDA Technologies
April 2005 Rambus unveils micro-threading technology for DRAM cores
March 2005 Industry ships 500 millionth RDRAM® memory device
March 2005 Rambus opens design center in Bangalore, India
February 2005 Cell Processor from Sony, Toshiba, and IBM uses Rambus high speed interface solutions
January 2005 Rambus announces Harold Hughes as new CEO; Geoff Tate becomes Chairman of the Board

2004

Month Description
October 2004 Toshiba announces its selection of Rambus DDR2 interface technology
September 2004 Rambus demonstrates its dynamic point-to-point topology
July 2004 Rambus signs agreements with Cadence to deliver portfolio of high-speed serial link solutions
March 2004 Toshiba and Rambus announce serial link cell agreement
February 2004 Rambus showcases industry's first TSMC 90 nanometer serial link cell solution

2003

Month Description
December 2003 Rambus acquires serial interface assets of Velio
November 2003 SiS launches R659 four channel RDRAM® chipset
July 2003 Rambus launches XDR™ DRAM, world's fastest memory
June 2003 Rambus samples industry's first chips with RaSer PCI Express PHY cell
February 2003 SiS, Samsung, ASUS and Rambus announce joint development of 4-channel RDRAM® performance chipset
February 2003 Rambus unveils Redwood, the industry's fastest parallel bus logic interface
January 2003 Rambus RDRAM® memory interface ships in award-winning HP AlphaServer systems
January 2003 Rambus signs technology license agreements with Sony, Sony Computer Entertainment and Toshiba

2002

Month Description
October 2002 Toshiba selects Rambus Yellowstone interface solution for next generation memory devices
October 2002 Rambus announces industry's first 10 Gbps backplane serial link solution, RaSer X
October 2002 Intel announces availability of 850E chipset supporting dual-channel 1066 RDRAM® memory for Pentium 4-based PCs
September 2002 Rambus announces Samsung Electronics has incorporated RDRAM® technology into next-generation rear-projection HDTV
July 2002 Rambus announces Texas Instruments Digital Light Processing display controllers with RDRAM® memory
July 2002 Rambus licenses RaSer serial link technology to Intel for Ethernet applications
July 2002 Rambus unveils first public demo of Yellowstone with FlexPhase™ technology, operating at 3.2GHz, at RDF Japan
June 2002 Rambus announces availability of RIMM 4200 memory module design using 1066 MHz RDRAM® memory, providing 4.2GB/s of memory bandwidth
June 2002 Juniper Networks uses Rambus RDRAM® technology for new T-Series family of Internet routers
June 2002 Rambus announces the first 6.4 Gbps backplane serial link cell, RaSer V

2001

Month Description
October 2001 Rambus announces licensing of RaSer serial link cell to Intel Microelectronics Services
September 2001 Rambus announces next generation high-speed signaling technology "Yellowstone", operating at Octal Date Rates, transferring 8 bits per clock
May 2001 Texas Instruments introduces first validated 533MHz Rambus RDRAM® clock generator

2000

Month Description
October 2000 Sony begins shipping highly anticipated game console, the PlayStation®2, with RDRAM®
October 2000 Rambus expands to Taipei, Taiwan
July 2000 Rambus announces first DRAM to break 1 GHz speed barrier
June 2000 Samsung ships 10 millionth RDRAM® to PC OEMs
June 2000 Rambus announces multi-level signaling technology capable of data transfer rate of 1.6 Gbps
April 2000 Rambus announces 3.125 GB/sec RaSer serial link

1999

Month Description
November 1999 Rambus-based PCs and workstations begin shipping from multiple suppliers

1998

Month Description
November 1998 Intel demonstrates working systems with 800MHz Rambus DRAMs at Fall COMDEX '98
June 1998 Toshiba and LG Semicon ship functional RDRAM® devices

1997

Month Description
May 1997 Rambus makes initial public offering of common stock

1996

Month Description
December 1996 Rambus and Intel disclose agreement to evolve chipsets and DRAMs that incorporate Rambus interfaces to meet requirements of PC main memory

1995

Month Description
December 1995 Nintendo64 ships with RDRAM® memory interface

1992

Month Description
February 1992 Rambus Japan (RKK) is incorporated

1990

Month Description
March 1990 Rambus is incorporated
 
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