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ファイル名: Analyzing Signal and Power Integrity Limitations for Mobile Memory Systems in 3D Packaging Environments

Mobile memory systems, optimized for low power dissipation, use advanced 3D packaging strategies like ‘Package-on-Package (PoP)’ and stacked memory devices to achieve high system density. As the bandwidth requirements of mobile systems increases, data rate scaling is limited by SI and PI effects. In this paper, we analyze a typical mobile memory system to identify the dominating Si and PI effects limiting data rate scaling in these systems. We present a model of the 3D system, analyze the impact of SI and PI effects on system performance, and discuss design improvements to increase the achievable data rate.

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今すぐダウンロード: 090202_designcon_paper_schmitt.pdf