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미디어 라이브러리 검색

Rambus 미디어 라이브러리에는 각종 비디오 자료, 프리젠테이션 및 기술 논문이 저장되어 있습니다. 시작하려면 아래에 검색하고자 하는 주제("XDR 2" 또는 "모바일")를 입력하십시오. 구체적인 기술, 이벤트 또는 년도를 구체적으로 지정하여 검색 결과를 좁힐 수 있습니다. 예를 들어 DesignCon 2009에서 발표된 논문을 찾으려면 "기술", "DesignCon" 및 "2009"를 선택하면 됩니다.


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Energy consumption has become a major constraint on the capabilities of computer systems. In large systems the energy consumed by Dynamic Random Access Memories (DRAM) is a significant part of the total energy consumption. It is possible...

Understanding the Energy Consumption of Dynamic Random Access Memories


A 5Gb/s signaling system was designed and fabricated in TSMC’s 40nm LP CMOS process. A new clock/data skew minimization technique with a source-synchronous transmit clock delay line and integrating receiver tolerates high frequency ...

A 5Gb/s Link with Clock Edge Matching and Embedded Common Mode Clock for ...


DDR3 SDRAM is being used in many computing systems today and offers data rates of up to 1600Mbps. To achieve performance levels beyond DDR3, future main memory subsystems must attain faster data rates while maintaining low power, access ...

Challenges and Solutions for Future Main Memory


See slides from Rambus Fellow Craig Hampel's presentation at the 2010 Multicore Expo. In this presentation, Mr. Hampel addresses memory architecture optimizations that can support the many threads and workloads handled by multi-core...

Memory Architectures for Multi-Core Computing


Rambus collaborated with IBM and Xilinx to establish a high-bandwidth interface between an IBM Power Processor and the latest Xilinx FPGAs via Rambus' FlexIO™ processor bus interface. Read this application note to learn more.

FPGA to IBM Power Processor Interface Setup


Paper presents a co-design approach for low cost, high performance consumer DDR3 memory interface. Design considerations are analyzed at every hierarchy (silicon/package/PCB) to meet performance and cost constraints. Strategies for cross...

High Performance, Low Cost DDR3- 1600Mbps+ Consumer Electronics Memory ...


There is a general consensus that 10 Gbps copper backplane serial links will be deployed in the near future. This paper takes a look at the practical and cost effective design aspects of the 10-12.5 Gbps links as well as the feasibility ...

Practical Design Considerations for 10 to 25 Gbps Copper Backplane Serial Links


Statistical link analysis has gained significant importance as high-speed interconnect designs require accurate bit error rate prediction with device jitter and noise. Currently available statistical analysis techniques focus on modeling...

Modeling and Simulation of Common Clocking Topologies for Statistical Link


A DDR3 interface for a data rate of 1600MHz using a wirebond package and a low-cost system environment typical for consumer electronics products was implemented. In this environment crosstalk and supply noise are serious challenges and ...

Signal and Power Integrity for a 1600 Mbps DDR3 PHY in Wirebond Package


In contrast to most chip-to-chip I/O interfaces that use differential signaling, the mainstream memory interface designs are based on single-ended signaling such as SSTL or PODL. Extending the data rate for single-ended signaling beyond ...

Study of Signal and Power Integrity Challenges in High-Speed Memory I/O ...

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