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File Name: In Situ Characterization of High Speed Signaling Systems with On Chip Measurements

Achieving a reliable full system model for high speed serial links often proves difficult as various components must be independently modeled or characterized. Increasingly prevalent on-chip characterization techniques enable direct measurement of both passive and active components in a full system. Techniques like the Rambus eScope transmits test waveforms while sweeping an auxiliary sampler in voltage and time to form an on chip sub-sampling oscilloscope. This paper presents a method for the extraction of models for the channel and for common active components from eScope waveforms. The measurements show that direct characterization of the signaling environment limits error accumulation over sequential components and reduces interface error between adjacent components. Finally, this paper will present examples of improved lab correlation to simulated system performance using the methods described.

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