Memory Architectures for Multi-Core Computing

Challenges and Solutions for Future Main Memory
DDR3 SDRAM is being used in many computing systems today and offers data rates of up to 1600Mbps. To achieve performance levels beyond DDR3, future main memory subsystems must attain faster data rates while maintaining low power, access ...

A Way to Meet Bandwidth and Capacity Needs of Next Generation Main Memory
Signal integrity issues pose a challenge to increasing the data rates of single ended systems. This paper presents techniques that help in increasing the data rates of next generation main memory systems to 1600-3200 Mbps range without ...

High Performance, Low Cost DDR3- 1600Mbps+ Consumer Electronics Memory ...
Paper presents a co-design approach for low cost, high performance consumer DDR3 memory interface. Design considerations are analyzed at every hierarchy (silicon/package/PCB) to meet performance and cost constraints. Strategies for cross...

Signal and Power Integrity for a 1600 Mbps DDR3 PHY in Wirebond Package
A DDR3 interface for a data rate of 1600MHz using a wirebond package and a low-cost system environment typical for consumer electronics products was implemented. In this environment crosstalk and supply noise are serious challenges and ...