Upcoming Events

IPC ESTC

May 20-23 | The New Tropicana | Las Vegas, NV

IPC ESTC is an exciting new event for the entire electronics industry, from foundry and components to board assemblies and complete systems. It’s an unprecedented opportunity to break new ground in the discussion of the technologies, products and services that will shape the future of the entire electronics industry. Learn more.

Presentations:
Tuesday, May 21, 2013

Title: “System Design of a Bufferless 6.4 Gb/s Server Multi-DIMM Memory Interface System”
8:00 a.m. – 12:00 p.m.
Yi Lu, Ravi Kollipara, and Arun Vaidyanath, Rambus

Rambus engineers will discuss details of the system design of a multi-DIMM memory interface system of 6.4 Gb/s data rate and 1.6 Gb/s C/A rate, showcasing innovations like fast power down exit and near ground signaling to reduce idle and active power consumption.

Title: “Consideration of Fiber Weave Effects in Selecting PCB Dielectric Material for 25/28 Gbps SerDes Applications”
8:00 a.m. – 12:00 p.m.
Gnanadeep Kollipara, David Secker, and Arun Vaidyanath, Rambus

In this paper presentation, Rambus engineers will demonstrate the impacts of the anisotropy of the fiber weave in one dielectric material by using identical strip line structures on a single fabricated PCB with traces at varying rotations.

Title: “3-D Si Interposer Manufacturing and Design Challenges”
8:00 a.m. – 12:00 p.m.
Ming Li, Mandy Ji, Julia Cline, John Lau, Pei-Jer Tzeng, Chau-Jie Zhan, and Ching-Kuan Lee, Rambus

In this presentation, Rambus engineers will present a 3-D silicon interposer design with double-sided active silicon chip attachments. Design and manufacturing challenges as well as solutions and package structure will be discussed.