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Home > Archives for gwelch@rambus.com > Page 2

gwelch@rambus.com

Rambus Announces Departure of Ron Black as Chief Executive Officer; Luc Seraphin Appointed Interim CEO

SUNNYVALE, Calif. – June 28, 2018 – Rambus Inc. (NASDAQ: RMBS) one of the world’s premier technology licensing companies, today announced that the Company’s Board of Directors has terminated Dr. Ron Black as Chief Executive Officer, effective immediately.

The termination follows an incident unrelated to the Company’s financial and business performance in which the Board determined Dr. Black’s conduct fell short of the Company’s standards. Dr. Black has also resigned from his position on the Rambus Board of Directors. The Board has appointed Luc Seraphin, Senior Vice President & General Manager, Memory and Interfaces Division, as interim CEO of the Company while the Board commences a formal search to identify a new CEO.

Eric Stang, Chairman of the Rambus Board of Directors, said, “This decision was not related to the Company’s operations or finances, and the Board looks forward to working with Luc as we continue to execute the Company’s current strategy and search for Rambus’ next CEO.”

As interim CEO, Mr. Seraphin will have full responsibility for overseeing the Company’s operations until a new CEO is appointed. Mr. Seraphin has served as Senior Vice President & General Manager of Rambus’ Memory and Interfaces Division since 2015. In his current role, Mr. Seraphin has made significant contributions to the development of innovative memory architectures and high-speed serial link solutions, including increasing Rambus’ market footprint for its DDR4 memory buffer chipset and positioning the Company to lead in next generation DDR5 memory buffer chips. Prior to this role, Mr. Seraphin was the Senior Vice President of Rambus’ Worldwide Sales and Operations, during which he oversaw sales, business development, customer support and operations across the Company’s various business units. Mr. Seraphin will retain his responsibilities as Senior Vice President & General Manager of the Memory and Interfaces Division during the interim period.

In addition, director Chuck Kissner has been appointed Vice Chairman of the Board. Mr. Kissner has served as a director on the Rambus Board since 2012. In his newly expanded role as Vice Chairman, Mr. Kissner will provide direct support to Mr. Seraphin and the Company’s senior management team during the interim period to ensure a smooth and effective transition.

Added Mr. Kissner, “We are confident in Luc’s leadership as we work to accelerate Rambus’ growth through the continued execution of key initiatives in strategic technology areas including the Data Center and Mobile Edge.”

About Rambus Inc.
Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security, and emerging technologies to positively impact the modern world. We collaborate with the industry, partnering with leading chip and system designers, foundries, and service providers. Integrated into tens of billions of devices and systems, our products power and secure diverse applications, including Big Data, Internet of Things (IoT) security, mobile payments, and smart ticketing. For more information, visit rambus.com.

Contacts:

Investors
Rahul Mathur, Senior Vice President, Finance and Chief Financial Officer
408-462-8000 / rmathur@rambus.com

Media
Sard Verbinnen & Co
Megan Bouchier / Monique Sidhom
415-618-8750

Imaging Innovator Gigajot Licenses Binary Pixel Technology from Rambus

Solution enables low-light photography and videography, scientific and medical imaging, automotive sensing, AR/VR and 3D

SUNNYVALE, CA and LEBANON, NH – Dec. 5, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced Dartmouth College-based startup Gigajot Technology has licensed Rambus Binary Pixel technology and patents for use in Gigajot’s next-generation image capture solutions. Gigajot’s Quanta Image Sensor (QIS) is a major paradigm shift in solid-state imaging which enables high-speed counting of single photons of light at gigapixel resolution. The new features enabled by QIS and Binary Pixel Technologies can benefit imaging applications such as scientific, automotive, security, defense, encryption, AR/VR, 3D and consumer photography, among others.

Based on the QIS technology developed by the Dartmouth-based research group of Dr. Eric Fossum, inventor of the “camera on a chip” found in billions of smartphones today, Gigajot’s third-generation solid-state imaging technology is sensitive enough to detect a single photon of light at room temperature and enables extremely high pixel densities. Rambus has supported the early work at Dartmouth on the technology. The single photon detection technology with its high sensitivity unlocks new capabilities in low-light photography and videography, scientific and medical imaging, automotive sensing, AR/VR and 3D, without sacrificing resolution or frame rate.

“Traditionally, it has been difficult to achieve acceptable signal-to-noise ratio in low-light situations for quality images,” said Dr. Saleh Masoodian, CEO, Gigajot. “Combining the Rambus Binary Pixel technology with Gigajot’s QIS devices enables development of highly sensitive imaging technology via mainstream commercial CMOS fabrication processes for not only consumer devices such as smartphones, tablets and cameras, but also for more high-end commercial pursuits such as scientific, medical, security and surveillance sensors and cameras.”

Rambus Binary Pixel technology combines a breakthrough imager and processor architecture to enable professional quality images and video from small form factor imagers for compact solutions. The technology mimics the brilliance of human visual processing by sensing photons using discrete thresholds to avoid pixel saturation and enable better light sensitivity. Binary Pixel also employs special oversampling methods, which subdivide pixels, exposure and digitization to capture more data and extend the dynamic range of the imager.

“Rambus Binary Pixel technology enables improved performance for small, compact image sensors, allowing unprecedented image quality for consumer devices,” said Laura Stark, SVP and general manager, Emerging Solutions of Rambus. “Combining the Gigajot and Rambus cutting-edge imaging technologies will dramatically improve the image capture experience for the next generation of consumers and professionals.”

For more information on Rambus Emerging Solutions Division, visit https://www.rambus.com/emerging-solutions/.

Follow Rambus:
Company website: rambus.com
Rambus blog: rambus.com/blog
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc 

About Rambus Emerging Solutions Division

Inspired by the innovative thinking at the heart of Rambus Labs, the Emerging Solutions division at Rambus works to translate extraordinary theory into everyday practice, imagining exciting new ways to interpret and reimagine the world of data around us.

About Rambus Inc.
Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security, and emerging technologies to positively impact the modern world. We collaborate with the industry, partnering with leading chip and system designers, foundries, and service providers. Integrated into tens of billions of devices and systems, our products power and secure diverse applications, including Big Data, Internet of Things (IoT) security, mobile payments, and smart ticketing. For more information, visit rambus.com.

About Gigajot Technology LLC
Gigajot is developing the next generation of image sensors where single photon counting is used to unlock new image capture capabilities for consumers and professionals not possible with today’s devices. The company was founded in 2017 by CEO Dr. Saleh Masoodian, CTO Dr. Jiaju Ma and Dr. Eric Fossum. At Gigajot, every photon counts. For more information, visit http://www.gigajot.tech.

Rambus Announces Pricing of $150 Million Convertible Senior Notes Offering

SUNNYVALE, Calif. — November 14, 2017 — Rambus Inc. (NASDAQ: RMBS) today announced the pricing of its offering of $150 million aggregate principal amount of its 1.375% Convertible Senior Notes due 2023 (the “notes”) in a private placement to qualified institutional buyers pursuant to Rule 144A under the Securities Act of 1933, as amended (the “Act”). Rambus has granted the initial purchasers a 13-day option to purchase up to an additional $22.5 million aggregate principal amount of the notes on the same terms and conditions to cover over-allotments, if any. The offering is expected to close on November 17, 2017, subject to satisfaction of customary closing conditions.

The notes will be unsecured, unsubordinated obligations of Rambus. Interest on the notes will be paid semi-annually at a rate of 1.375% per annum, and the notes will mature on February 1, 2023, unless earlier repurchased or converted. Holders may require Rambus to repurchase their notes upon the occurrence of certain events that constitute a fundamental change under the indenture governing the notes at a purchase price equal to the principal amount thereof plus accrued and unpaid interest to, but excluding, the repurchase date. Rambus may not redeem the notes prior to maturity.

Prior to November 1, 2022, the notes will be convertible at the option of the holders only during certain periods upon the occurrence of specified events, and thereafter until the close of business on the second scheduled trading day immediately preceding the maturity date, the notes will be convertible at the option of the holders at any time. The notes will be convertible, subject to certain conditions, into cash up to the aggregate principal amount of the notes to be converted, and any excess conversion value will be convertible into cash, shares of Rambus’ common stock (the “common stock”) or a combination of cash and shares of common stock, at Rambus’ election. The initial conversion rate will be 52.8318 shares of common stock per $1,000 principal amount of notes, which is equivalent to an initial conversion price of approximately $18.93 per share of common stock, subject to adjustment in certain circumstances. This initial conversion price represents a premium of approximately 30% relative to the last reported sale price of Rambus’ common stock of $14.56 per share on November 14, 2017.

Rambus intends to use a portion of the net proceeds of the offering of the notes to pay the cost of the convertible note hedge transactions described below (after such cost is partially offset by the proceeds to Rambus of the warrant transactions described below) and to use the remaining proceeds of the offering for (i) the repurchase of approximately $56.8 million aggregate principal amount of Rambus’ 1.125% convertible senior notes due 2018 (the “2018 Notes”) concurrently with the offering of the notes, through one of the initial purchasers of the notes or its affiliates in individually negotiated transactions and (ii) general corporate purposes.

In connection with the pricing of the notes, Rambus entered into convertible note hedge transactions with one or more of the initial purchasers or their affiliates and other financial institutions (the “option counterparties”). The convertible note hedge transactions are generally expected to reduce potential dilution to the common stock upon any conversion of notes and/or offset any cash payments Rambus is required to make in excess of the principal amount of converted notes, as the case may be. However, the warrant transactions would separately have a dilutive effect to the extent that the market value per share of the common stock exceeds the strike price of any warrants. The strike price of the warrant transactions will initially be approximately $23.30 per share, which represents a premium of 60% over the last reported sale price of the common stock on November 14, 2017, and is subject to certain adjustments under the terms of the warrant transactions. If the initial purchasers exercise their over-allotment option to purchase additional notes, Rambus may enter into additional convertible note hedge and additional warrant transactions relating to the additional notes.

In connection with establishing their initial hedge of the convertible note hedge and warrant transactions, the option counterparties or their respective affiliates expect to purchase shares of the common stock and/or enter into various derivative transactions with respect to the common stock concurrently with or shortly after the pricing of the notes. This activity could increase (or reduce the size of any decrease in) the market price of the common stock or the notes at that time.

In addition, the option counterparties or their respective affiliates may modify their hedge positions by entering into or unwinding various derivatives with respect to the common stock and/or purchasing or selling the common stock or other securities of Rambus in secondary market transactions following the pricing of the notes and prior to the maturity of the notes (and are likely to do so during any observation period related to a conversion of notes or in connection with any repurchase of notes by Rambus). This activity could also cause or avoid an increase or a decrease in the market price of the common stock or the notes, which could affect the ability of noteholders to convert the notes and, to the extent the activity occurs during any observation period related to a conversion of notes, it could affect the amount and value of the consideration that noteholders will receive upon conversion of such notes. The convertible note hedge transactions and warrant transactions have not been, and will not be, registered under the Act or the securities laws of any other jurisdiction and may not be offered or sold in the United States absent registration or an applicable exemption from such registration requirements.

In connection with the purchase of the 2018 Notes, Rambus expects that holders of the 2018 Notes submitting their 2018 Notes for repurchase may purchase shares of common stock to close out their hedge positions with respect to the 2018 Notes, which activity may increase the market price of the common stock.

This announcement is neither an offer to sell nor a solicitation of an offer to buy any of these securities and shall not constitute an offer, solicitation, or sale in any jurisdiction in which such offer, solicitation, or sale is unlawful. Any offer of the securities will be made only by means of a private offering memorandum. The notes and the shares of common stock issuable upon conversion of the notes, if any, will not be registered under the Act or any state securities laws, and unless so registered, may not be offered or sold in the United States except pursuant to an exemption from the registration requirements of the Act and applicable state laws.

Rambus and Northwest Logic Certify Interoperability of HBM2 Interface Solution for High-performance Networking and Data Center Applications

Integrated HBM2 PHY and Memory Controller provide validated, standards-compliant memory subsystem with superior signal integrity and reliability

SUNNYVALE, Calif. – Aug. 23, 2017 – Rambus Inc. (NASDAQ: RMBS), an innovator in semiconductor and IP products, today announced validated interoperability between its HBM2 PHY and Northwest Logics’ HBM2 Memory Controller Core. The solution builds on the growing ecosystem of Rambus partner products that interoperate with its latest HBM2 PHY IP core. The combined HBM2 solution is designed to support high-performance networking and server applications in the data center and communications markets that require the maximum amount of bandwidth available through HBM2.

“Our work with Northwest Logic gives Rambus the functionality to provide a verified solution that reduces the engineering workload and time to market for chip designers” said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces Division. “As Rambus extends its footprint in PHY support for leading-edge technologies, collaborative interoperability is essential for our end customers that demand early adoption. Memory interfaces are increasingly important in today’s new workloads, and the combination of Rambus HBM2 and Northwest Logic’ HBM2 Memory Controller core is a natural fit to support customer demands on both sides.”

The Northwest Logic HBM2 Memory Controller Cores are optimized for use in both ASICs and FPGAs, and support full-rate, half-rate and quarter-rate operations. The cores provide a solution that can be configured to exact customer requirements, are silicon-proven and are verified with the Rambus HBM2 PHY.

“Our HBM2 Memory Controller Core has been successfully deployed in a wide variety of customer systems demonstrating high reliability and performance,” said Brian Daellenbach, president of Northwest Logic. “We are excited to offer a complete HBM2 solution with Rambus ensuring our customers achieve the best possible combined memory solution for their high data demands.”

The Rambus HBM2 PHY and Northwest Logic HBM2 Memory Controller are each fully JEDEC compliant to the HBM2 standard, allowing the PHY and memory controller to interoperate. The Rambus HBM2 PHY is a high-performance memory IP core that features reduced power consumption and a small form factor. It combines 2.5D packaging with a wider interface at a lower clock speed, delivering higher efficiency and lower power consumption compared to other memory solutions on the market. For additional information on Rambus HBM2 PHY solutions, please visit https://www.rambus.com/memory-and-interfaces/ddrn-phys/hbm/

Follow Rambus:
Company website: rambus.com
Rambus blog: rambus.com/blog
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc 

About Rambus Memory and Interfaces Division 
The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.
Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile payments, and smart ticketing. At Rambus, we are makers of better. For more information, visit rambus.com.

SerDes Signal Integrity Challenges at 28Gbps and Beyond

This paper will discuss the various challenges of designing high speed SerDes, as well as the importance of detailed modeling and design of highly programmable circuits and debug interfaces.

What is Host Card Emulation (HCE)?

Host Card Emulation (HCE) technology is making it easier for banks to offer mobile (NFC) payments to their customers. Learn more in this video.

What What is Host Card Emulation
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