Exploring 2.5D packaging and beyond
Frank Ferro, a Senior Director of Product Marketing at Rambus, recently participated in a Semiconductor Engineering roundtable discussion about 2.5D and advanced packaging. According to
March 11, 2019
At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
Architecting new memory for the IoT
The once indefatigable Moore’s Law is beginning to slow, even as data, driven by a burgeoning Internet of Things (IoT), continues to increase exponentially. Consequently,
March 11, 2019
ReRAM gains traction in the memory space
Writing for Semiconductor Engineering, Michael Watts reports that Resistive RAM (ReRAM) appears to be gaining traction. “Once considered a universal memory candidate—a replacement for DRAM,
March 11, 2019
When memory and storage converge
Earlier this week, Rambus Chief Scientist Craig Hampel gave a keynote presentation at MemCon 2015 that explored the increasingly blurred lines between memory and storage.
June 13, 2019
Minding the memory gap
Mark LaPedus of Semiconductor Engineering recently reported that memory chips and storage devices are struggling to keep pace with the growing demands of data processing. “To
March 11, 2019
Memory price dip to spur DDR4 adoption
KitGuru’s Anton Shilov reports that DDR4 prices have dropped approximately 25% since late June. “According to DRAMeXchange, the world’s leading computer memory tracker, one 4Gb
March 11, 2019
