Cyber attack shatters the digital-physical barrier
Writing for Wired, Kim Zetter reports that a recent cyber intrusion in Germany marked the second confirmed case in which a (wholly) digital attack caused
March 11, 2019
At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
The evolution of LPDDR4
Ajay Jain, a director of product marketing at Rambus, recently told Semiconductor Engineering that LPDDR3 was the “workhorse” of the mobile memory market in 2014.
March 11, 2019
Lensless smart sensor technology is SWaP-C friendly
Writing for Military Embedded Systems, Amanda Harvey notes that stringent size, weight, power and cost (SWaP-C) requirements are influencing nearly every modern military platform. “Everything
March 11, 2019
Tezzaron licenses Rambus ReRAM
Rambus and Tezzaron Semiconductor have clinched an agreement to incorporate Rambus oxide-resistive memory (ReRAM) technology in upcoming Tezzaron devices. According to Rambus Labs VP Gary
March 11, 2019
Are stacked die creating new security risks?
Writing for Semiconductor Engineering, Ernest Worthman notes that while stacked die may improve performance and lower power, the use of through-silicon vias (TSVs) could potentially
March 11, 2019
On-chip Noise Monitor accelerates time-to-market for complex SOCs
Rambus has added an On-chip Noise Monitor to its suite of tools and IP cores. According to Loren Shalinsky, a Strategic Development Director at Rambus,
March 11, 2019
