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GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory (HBM) solution

GLOBALFOUNDRIES has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14™ integrated design system for application-specific integrated circuits (ASICs). According to Kevin O’Buckley, VP of ASIC product development at GF, [...]

Why HBM2 is all about the PHY

Rambus’ Bill Fuller recently penned an article for Semiconductor Engineering about HBM2 DRAM. As Fuller observes, HBM DRAM is currently used in graphics, high-performance computing (HPC), server, networking and client applications. Recent examples of second-generation [...]

The rise of high bandwidth memory (HBM)

Semiconductor Engineering’s Ann Steffora Mutschler recently penned an article about high bandwidth memory (HBM). As Mutschler observes, the latest iteration of HBM continues its rise as a viable contender in the memory space. Indeed, HBM [...]

Saving power with HBM

Ed Sperling of Semiconductor Engineering notes that power has always been a “global concern” in the design process because it affects every part of a chip. Nevertheless, partitioning for power rather than functionality or performance has [...]

ChipEstimate and Rambus look beyond DDR4

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Frank Ferro, a senior director of product management at Rambus, has penned an article for ChipEstimate about the future of DRAM in the age of the IoT. According to Ferro, the semiconductor industry has traditionally relied [...]

The DDR5-HBM connection

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Frank Ferro, senior director of product marketing at Rambus, recently told SemiconductorEngineering’s Ed Sperling that he was looking forward to seeing what the company could do for next-gen DDR5 as well as evolving high-bandwidth memory [...]