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Rambus Design Summit 2026 explores how next-generation memory, interconnect and security technologies are enabling the rise of autonomous AI. From AI training and large-scale inference in the data center to reasoning-enabled AI PCs and edge systems, this virtual event examines the critical role of these technologies in supporting increasingly sophisticated AI agents.
Achieved strong Q1 results, delivering quarterly product revenue of $88.0 million, up 15% year over year Generated strong quarterly cash from operations of $83.2 million Expanded product and IP offerings for next-generation AI platforms, including the LPDDR5X SOCAMM2 server module chipset, the industry’s fastest HBM4E memory controller IP SAN JOSE, Calif. – April 27, 2026 […]
As AI workloads continue to diversify, the systems that support them are evolving just as quickly. AI is no longer confined to the hyperscale data center. It is moving to the factory floor, into vehicles, and increasingly to the edge, where power, cost, and form factor constraints can matter just as much as raw performance.
[Live on April 8 at 11am PT] Join Rambus for a technical deep dive into HBM4E and the industry-leading HBM4E Memory Controller IP. In this webinar, Nidish Kamath from Rambus will walk through the key requirements driving HBM4E adoption and introduce Rambus’ newly announced HBM4E Memory Controller IP.
Download the product to learn about the Rambus HBM4E Controller. Our HBM4E Controller is designed to support customers with deploying a new generation of HBM memory for cutting-edge AI accelerators, graphics and high-performance computing (HPC) applications.
Rambus offers the industry’s fastest HBM4E Controller IP core designed to support customers with deploying a new generation of HBM memory for cutting-edge AI accelerators, graphics and high-performance computing (HPC) applications.
Highlights: Built on a proven track record of over one hundred HBM design wins to ensure first-time silicon success Delivers up to 16 Gigabits per second per pin at low latency to meet the demands of next-generation AI and High-Performance Computing (HPC) workloads Expands industry-leading silicon IP portfolio of high-performance memory solutions SAN JOSE, Calif. […]
AI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will […]
[Updated on March 4, 2026] In an era where data-intensive applications, from AI and machine learning to high-performance computing (HPC) and gaming, are pushing the limits of traditional memory architectures, High Bandwidth Memory (HBM) has emerged as a high-performance, power-efficient solution. As industries demand faster, higher throughput processing, understanding HBM’s architecture, benefits, and evolving role […]
A System on Chip (SoC) is an integrated circuit that consolidates all essential components of a computer or electronic system, including CPU, GPU, memory controllers, I/O interfaces, and often specialized accelerators, onto a single chip
