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Found 27 Results
Rambus Design Summit Featured Speaker: Steven Woo
https://www.rambus.com/blogs/rambus-design-summit-featured-speaker-steven-woo/Another week, another Rambus Design Summit wrap up! Over the coming weeks, we will be featuring sessions from RDS 2021 with key takeaways and speaker highlights. This week we are featuring… Session Topic: Emerging Compute Architectures for the Evolving Data Center Rambus fellow and distinguished inventor, Dr. Steven Woo, kicked off the Rambus Design Summit […]
New interface architectures enable data scaling
https://www.rambus.com/blogs/new-interface-architectures-enable-data-scaling/Suresh Andani, senior director of product marketing at Rambus, has written an article for Semiconductor Engineering that takes a closer look at why data center scaling requires new interface architectures. As Andani notes, global data traffic is growing at an exponential rate. More specifically, 5G networks are enabling billions of AI-powered IoT devices untethered from […]
Designing chiplet and co-packaged optics architectures with 112G XSR SerDes
https://www.rambus.com/blogs/designing-chiplet-and-co-packaged-optics-architectures-with-112g-xsr-serdes/Suresh Andani, senior director of product marketing at Rambus, has written an article for Semiconductor Engineering that takes an in-depth look at how 112G XSR SerDes can be used to optimally design chiplet and co-packaged optics architectures. As Andani notes, conventional chip designs are struggling to achieve the scalability, as well as power, performance, and […]
Stacking memory for AI/ML training with HBM2E
https://www.rambus.com/blogs/stacking-memory-for-ai-ml-training-with-hbm2e/Frank Ferro, Senior Director Product Management at Rambus, recently penned an article for Semiconductor Engineering that takes a closer look at high bandwidth memory (HBM) and 2.5D (stacking) architecture for AI/ML training. As Ferro notes, the impact of AI/ML increases daily – impacting nearly every industry across the globe. “In marketing, healthcare, retail, transportation, manufacturing […]
The Thermal Challenges of Moore’s Law: Part 2
https://www.rambus.com/blogs/the-thermal-challenges-of-moores-law-part-2/In part one of this two-part blog series, Semiconductor Engineering editor in chief Ed Sperling spoke with Steven Woo, Rambus fellow and distinguished inventor, about the relationship between Moore’s Law and the thermal challenges faced by the semiconductor industry. Specifically, Woo highlighted how the breakdown of Dennard scaling around 2005 prompted GPU designers to place […]
The Thermal Challenges of Moore’s Law: Part 1
https://www.rambus.com/blogs/the-thermal-challenges-of-moores-law-part-1/Semiconductor Engineering editor in chief Ed Sperling spoke with Steven Woo, Rambus fellow and distinguished inventor, about the relationship between Moore’s Law, Dennard scaling and thermal challenges. As Woo notes, there is a “tug of war” between the benefits that Moore’s Law provides and the breakdown of Dennard scaling in 2005. “Systems now need to […]
Memory a Key Enabler of Continued Advancement of AI/ML
https://www.rambus.com/blogs/memory-a-key-enabler-of-continued-advancement-of-ai-ml/Recently Rambus fellow and distinguished inventor, Steve Woo, had a web chat with Bill Wong, technology editor for Electronic Design, to discuss some of the latest hardware trends in AI/ML. This was part of an ongoing conversation Steve and Bill have had regarding leading-edge developments in the AI/ML revolution. In the webcast, Steve discusses some […]
Memory Systems for AI: Part 2
https://www.rambus.com/blogs/memory-systems-for-ai-part-2/In part one of this series, we discussed how the world’s digital data is growing exponentially, doubling approximately every two years. In fact, there’s so much digital data in the world that artificial intelligence (AI) is practically the only way to begin to make sense of it all in a timely fashion. Insights gleaned from […]
Memory Systems for AI: Part 1
https://www.rambus.com/blogs/memory-systems-for-ai-part-1/Written by Steven Woo for Rambus Press There has been quite a lot of recent news about domain-specific processors that are being designed for the artificial intelligence (AI) market. Interestingly, many of the techniques used today in modern AI chips and applications have actually been around for several decades. However, neural networks didn’t really take […]
An Introduction to HPC computing
https://www.rambus.com/blogs/an-introduction-to-hpc-computing/Written by Steven Woo Dominated by the United States, Japan and China, the high-performance computing (HPC) space is driven by an insatiable demand for ever-higher performance and greater power efficiency. With each new supercomputer debut, the above-mentioned trio sets progressively higher bars with the goal of capturing the highest Top500 score. Summit, Sierra and Sunway […]
