对于AI和HPC的应用，2.5D/3D结构使HBM2E存储器能够在非常紧凑的空间里提供出色的带宽、容量和延迟。然而，相同的结构也导致更大的设计复杂性，并提出了一系列新的实现注意事项。
At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
