Across a broad spectrum of applications spanning automotive, artificial intelligence (AI), Internet of Things (IoT), network edge, and data center, there is a common need to move more data faster. Incredible advances in processing have pushed the bandwidth bottleneck from the core, to the memory and chip-to-chip interfaces at the SoC boundary. Rambus SerDes and memory IP close that gap delivering the performance needed by the most demanding applications to move the data at blinding fast speeds.
High-performance SerDes PHY solutions optimized for power and area, support a wide range of applications
Silicon-proven, high-performance digital IP controller cores from Northwest Logic
Supported by Micron Technology, SK Hynix and Samsung, GDDR6 SGRAM will feature a maximum data transfer rate of 16 Gbps, along with an operating voltage of 1.35V. GDDR6 offers higher densities compared to previous-generation graphics memory. In addition, GDDR6 doubles the speed (12–16 Gb/s) of GDDR5 and provides more than 5X the 3.2 Gb/s speed of DDR4. Although initially targeted at game consoles and PC graphics, the latest iteration of GDDR is expected to be deployed across multiple verticals, with Micron specifically highlighting the data center and automotive sector.
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