At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
Upcoming Events 
Join us at TSMC Japan OIP Ecosystem Forum! Toru Furukawa, Senior Field Applications Engineer at Rambus and Kos Gitchev, Product Marketing Director at Cadence will be presenting on GDDR Memory for High-Performance AI Inference. Session information below. To learn more and register, follow the link here: https://tsmc-signup.pl-marketing.biz/attendees/2025oip/jp/ Title: GDDR Memory for High-Performance AI Inference Speakers: […]
We are excited to be participating at ESCAR in Germany! Stay tuned for more details. To learn more and register for ESCAR, visit the link here: https://escar.info/escar-europe
Join us at Taiwan OIP Ecosystem Forum! Our experts will be giving a presentation about GDDR Memory for High-Performance AI Inference. To learn more and register, follow the link here: https://tsmc-signup.pl-marketing.biz/attendees/2025oip/tw/ Title: GDDR Memory for High-Performance AI Inference Speakers: TBD Abstract: The rapid rise in size and sophistication of AI/ML inference models requires increasingly powerful […]
Join us on November 26, 2025 in Amsterdam for Rambus Design Seminar Europe! Our industry experts will explore the latest advancement in chip and IP design for AI, automotive, and data center applications. Don’t miss the opportunity to network with peers and technology leaders. Register today!
Can’t make it in person to TSMC OIP Ecosystem Forum? Join us for their Online VOD event! On November 27th, our experts will speak about memory and interconnect technology enabling AI. Abstract information below. Learn more by following the link here: https://tsmc-signup.pl-marketing.biz/attendees/2025oip/tw/ Title: Why PCIe and CXL are Critical Interconnects for the AI Era Speaker: […]
