SUNNYVALE, CALIFORNIA, UNITED STATES and MILPITAS, CALIFORNIA, UNITED STATES – 07/24/2012 – Rambus Inc. (Nasdaq:RMBS) and GLOBALFOUNDRIES today announced the results from their collaboration on two separate memory architecture-based silicon test chips. The first test chip demonstrates solutions for mobile memory applications, such as smartphones and tablets. The second test chip demonstrates solutions for compute main memory applications, such as servers. Using GLOBALFOUNDRIES’ 28-nanometer super low power (28nm-SLP) process, and demonstrating the capabilities of one of the most power efficient and highest performance analog/mixed-signal offerings for advanced system-on-chip (SoC) developments, the results of the two test chips have surpassed power and performance expectations.
“The partnership with GLOBALFOUNDRIES is vital to our ongoing commitment to innovation that advances the leading edge of electronics performance,” said Sharon Holt, senior vice president and general manager of the Semiconductor Business Group at Rambus. “GLOBALFOUNDRIES’ 28nm-SLP process is ideal for achieving multi-gigahertz data rates at unmatched power efficiencies.”
“Our 28nm-SLP technology gives SoC designers a robust manufacturing option for a new generation of feature-rich consumer and mobile devices, and assures optimal power consumption that is critical for success in these markets,” said Mojy Chian, senior vice president of Design Enablement at GLOBALFOUNDRIES. “We are pleased to be working closely with Rambus to demonstrate the capabilities and design enablement ecosystem available for the industry’s most cost-effective and versatile 28SLP process.”
Rambus’ mobile and server memory architectures are designed to meet the growing performance demands of future systems driven by applications such as 3D gaming, HD video streaming, capture and encoding, while providing unmatched power efficiency. With the rising popularity of streaming video, smartphones, tablets, and other smart mobile devices, there is a growing need for next-generation dynamic random access memory (DRAM) technologies capable of delivering the bandwidth necessary to power devices with the latest feature sets.
GLOBALFOUNDRIES’ 28nm-SLP technology is designed specifically for the next generation of smart mobile devices, enabling designs with faster processing speeds, smaller feature sizes, lower standby power and longer battery life. The technology is based on bulk silicon CMOS substrates and utilizes the same “Gate First” approach to High-k Metal Gate (HKMG) that has reached volume production in GLOBALFOUNDRIES Fab 1 in Dresden, Germany.
Over the past two years, Rambus and GLOBALFOUNDRIES have collaborated on a number of 28nm-SLP test chips covering core Rambus memory architectures for both mobile and server-based applications. The test chips leverage the wide range of design enablement support and solutions GLOBALFOUNDRIES offers, including process design kits (PDKs), extensive implementation services, and its DRC+™ design-for-manufacturing technology. Previously, Rambus has also used the GLOBALFOUNDRIES assembly support team to provide wirebond and flipchip packaging options on high-speed PHY designs.
More information on Rambus’ design implementation using the GLOBALFOUNDRIES 28nm-SLP process can be found in the companies’ 28nm collaboration white paper at: http://globalfoundries.com/eBooks/white%20papers/GF_Rambus_WhitePaper.aspx
About GLOBALFOUNDRIES
GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 150 customers. With operations in Singapore, Germany and the United States, GLOBALFOUNDRIES is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GLOBALFOUNDRIES is owned by the Advanced Technology Investment Company (ATIC). For more information, visit http://www.globalfoundries.com.
About Rambus Inc.
Founded in 1990, Rambus is one of the world’s premier technology licensing companies. As a company of inventors, Rambus focuses on the development of technologies that enrich the end-user experience of electronic systems. Its breakthrough innovations and solutions help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Rambus has offices in California, North Carolina, Ohio, India, Germany, Japan, Korea, and Taiwan. Additional information is available at www.rambus.com.