General
AI Requires Tailored DRAM Solutions: Part 1
Frank Ferro, Senior Director Product Management at Rambus, and Shane Rau, Senior Research Executive at IDC, recently hosted a webinar that explores the role of
September 11, 2020
At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
General
Rambus Announces 2020 Design Summit
The Rambus 2020 Design Summit kicks off on Thursday, October 08, 2020 at 09:00 AM Pacific Daylight Time. Throughout the day, our technology experts will
September 10, 2020
General
The Thermal Challenges of Moore’s Law: Part 2
In part one of this two-part blog series, Semiconductor Engineering editor in chief Ed Sperling spoke with Steven Woo, Rambus fellow and distinguished inventor, about
October 29, 2024
General
The Thermal Challenges of Moore’s Law: Part 1
Semiconductor Engineering editor in chief Ed Sperling spoke with Steven Woo, Rambus fellow and distinguished inventor, about the relationship between Moore’s Law, Dennard scaling and
April 16, 2020
General
Post-Quantum Crypto and Rambus
Today’s encryption methods are generally broken down into two types: symmetric and asymmetric. Symmetric encryption relies on the sender and receiver to have identical, secret
April 8, 2020
AI & Machine Learning
Memory Systems for AI: Part 6
In part 5 of this series, we discussed the most common memory systems that are used in the highest performance AI applications. These include on-chip
September 16, 2025
