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MACsec Explained: Everything You Need to KnowRead BlogRambus DDR5 RDIMM 8000 Chipset Named Semiconductor Product of the Year from the Data Breakthrough AwardRead PostHBM: Everything You Need to KnowRead Post Rambus Blog

The need to simplify tokenization for mobile payments

https://www.rambus.com/blogs/the-need-to-simplify-tokenization-for-mobile-payments/

André Stoorvogel, Director, Product Marketing at Rambus, describes the increasing challenges associated with managing tokenization activity. As Stoorvogel notes in a blog post, banks around the world are working to develop, launch and expand mobile payments services offered to customers. Numerous issuers, say Stoorvogel, already support the ‘OEM Pays’ – Apple Pay, Android Pay and Samsung […]

Rambus Signs Patent License Agreement with Winbond

https://www.rambus.com/rambus-signs-patent-license-agreement-with-winbond/

Broad agreement addresses device and cloud demands for high bandwidth, low latency, efficient memory solutions SUNNYVALE, Calif. – January 16, 2017 – Rambus Inc. (NASDAQ:RMBS) today announced it has signed a broad five-year patent license agreement with Winbond Electronics Corporation, a worldwide leading supplier of specialty memory. This agreement covers the use of Rambus patented […]

Happy 25th birthday, HAL!

https://www.rambus.com/blogs/happy-25th-birthday-hal/

Rambus Fellow Dr. David G. Stork recently penned an article for Semiconductor Engineering to mark the 25th birthday of HAL 9000, a (fictional) sentient computer which became operational on January 12, 1992 at the HAL Laboratories in Urbana, Illinois. “Nearly a half-century ago [in 2001: A Space Odyssey], Arthur C. Clarke and Stanley Kubrick introduced […]

Mobile proximity payments to hit $92 billion by 2019

https://www.rambus.com/blogs/mobile-proximity-payments-to-hit-92-billion-by-2019/

With mobile proximity payments projected to reach $92 billion by 2019, merchants and card issuers are reportedly rushing to release branded mobile apps that capitalize on both in-store and online payments growth. According to Javelin, hundreds of new payment apps will flood the market by 2018, although fragmented payments apps are ultimately expected to converge […]

How can banks simplify tokenization?

https://www.rambus.com/blogs/how-can-banks-simplify-tokenization/

Banks around the world are working to develop, launch or expand the mobile payments services they offer to their customers. Many issuers already support the ‘OEM Pays’ – Apple Pay, Android Pay and Samsung Pay – and many more will seek to as they roll-out into other countries. As part of this process, banks work […]

Securing chips for the IoT

https://www.rambus.com/blogs/securing-chips-for-the-iot/

Jeff Dorsch of Semiconductor Engineering notes that chips and modules going into Internet of Things (IoT) node devices “must have” cybersecurity features designed and built into them. “Multiple vendors are responding with products meant to keep the IoT devices protected from the cyberattacks that are becoming more common,” he explained. “While IoT privacy remains a key […]

Our Top 5 Smart Ticketing Predictions for 2017

https://www.rambus.com/blogs/our-top-5-smart-ticketing-predictions-for-2017/

Our top 5 predictions for 2017 The UK boasts many successful smart ticketing schemes outside its capital – such as the Robin Hood Network in Nottingham, Nexus Pop in Tyne and Wear and Bramble on the Glasgow subway. The next step for the ticketing industry is connecting these localised ‘islands’ so that we can move […]

Minimizing IoT DDoS attacks: Rambus Showcases IoT Security Demo with Qualcomm Technologies at CES 2017

https://www.rambusblog.com/2017/01/09/minimizing-iot-ddos-attacks-rambus-showcases-iot-security-demo-with-qualcomm-technologies-at-ces-2017/#new_tab

Last week, Rambus showcased its IoT security service and technology in the Qualcomm Technologies booth (#10948) exclusively at CES® 2017 in Las Vegas. The service and technology offerings by Rambus are designed to take advantage of security-focused features in Qualcomm Technologies’ chipsets to facilitate protected IoT communication and lifecycle management.

Minimizing IoT DDoS attacks: Rambus Showcases IoT Security Demo with Qualcomm Technologies at CES 2017

https://www.rambus.com/blogs/minimizing-iot-ddos-attacks-rambus-showcases-iot-security-demo-with-qualcomm-technologies-at-ces-2017-2/

Last week, Rambus showcased its IoT security service and technology in the Qualcomm Technologies booth (#10948) exclusively at CES® 2017 in Las Vegas. The service and technology offerings by Rambus are designed to take advantage of security-focused features in Qualcomm Technologies’ chipsets to facilitate protected IoT communication and lifecycle management. Image Credit: CES This demonstration […]

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