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Even More CXL Webinar Q&A!

We had such a great response to last week’s More CXL Webinar Q&A blog that we decided to reprise the questions answered live in our webinar How CXL Technology will Revolutionize the Data Center (available on-demand). Hope this provides more insights on the capabilities of Compute Express Link™ (CXL™) technology. Click on a link below […]

More CXL Webinar Q&A

In our recent webinar How CXL Technology will Revolutionize the Data Center (available on-demand), we received far more questions than we had time to address during the scheduled Q&A. What follows are answers to many of those questions providing greater context on the capabilities of Compute Express Link™ (CXL™) technology. Click on a link below […]

Automotive Security: Meeting the Growing Challenges

[Jan 18 @ 10am PT] Vehicle systems and the semiconductors used within them represent some of today’s most complex electronics. In the drive to autonomous vehicles, increasingly sophisticated electronic systems are being developed for powertrain and vehicle dynamics, advanced driver assistance systems (ADAS), vehicle-to-everything (V2E) connectivity, infotainment, and in-vehicle experience. In addition to achieving higher […]

VESA Display Stream Compression (DSC): The Complete Guide

Learn everything you need to know about VESA Display Stream Compression (DSC), simply explained in our blog. Start reading! Display technology has advanced in leaps and bounds over the past decade. Electronics manufacturers have been using increasingly sophisticated display features as a way of differentiating their products in the highly competitive consumer electronics market. Each […]

Going Beyond the Requirements of a Root of Trust for Measurement with the Silicon-Proven RT-660 Root of Trust

The continuously evolving technology landscape and security requirements for systems present many challenges for device and silicon manufacturers. Nowhere is this truer than in data centers. Rambus has long recognized the need for security designs in data centers, and the Caliptra initiative discussed in this whitepaper is a welcome step towards a widespread adoption of […]

Accelerating AI/ML applications in the data center with HBM3

Semiconductor Engineering Editor in Chief Ed Sperling recently spoke with Frank Ferro, Senior Director of Product Management at Rambus, about accelerating AI/ML applications in the data center with HBM3. Introduced by JEDEC in early 2022, the latest iteration of the high bandwidth memory standard increases the per-pin data rate to 6.4 Gigabits per second (Gb/s), […]

Rambus Reports Third Quarter 2022 Financial Results

Exceeded guidance for Q3 revenue and earnings Delivered record quarterly product revenue driven by memory interface chips Generated $80 million in cash from operations Initiated $100 million accelerated share repurchase program SAN JOSE, Calif. – October 31, 2022– Rambus Inc. (NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported […]

Rambus and Samsung Electronics Extend Comprehensive Agreement

Ten-year agreement enables deep collaboration on products and broad access to Rambus innovations SAN JOSE, Calif. – Oct. 31, 2022 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced it has extended its comprehensive patent license agreement with Samsung Electronics, a world leader in advanced semiconductor […]

RT-641 Embedded HSM (Root of Trust)

Security RT-641 Embedded HSM (Root of Trust) ISO-26262 ASIL-B Compliant for Designs with Chinese Algorithms The Rambus RT-640 Root of Trust is a fully programmable ASIL-B certified hardware security core. The RT-641 complements the RT-640 with Chinese cipher algorithms SM2, SM3 and SM4, offering security by design for automotive applications that require Chinese crypto-based security […]

CXL 3.0: Novel Device Types, Capabilities, and Interconnects

This video introduces new concepts that were developed as part of the latest CXL 3.0 specification released in August 2022. Danny Moore covers Multi-Headed Device (MHD) and Dynamic Capacity Device (DCD) capabilities, and how Fabrics, Fabric Switches and Port-based routing mechanisms expand the CXL interconnect beyond the rack for the data center of the future.