At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
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HBM4E Controller
https://www.rambus.com/interface-ip/hbm/hbm4e-controller/Rambus offers the industry’s fastest HBM4E Controller IP core designed to support customers with deploying a new generation of HBM memory for cutting-edge AI accelerators, graphics and high-performance computing (HPC) applications.
Rambus Sets New Benchmark for AI Memory Performance with Industry-Leading HBM4E Controller IP
https://www.rambus.com/rambus-sets-new-benchmark-for-ai-memory-performance-with-industry-leading-hbm4e-controller-ip/Highlights: Built on a proven track record of over one hundred HBM design wins to ensure first-time silicon success Delivers up to 16 Gigabits per second per pin at low latency to meet the demands of next-generation AI and High-Performance Computing (HPC) workloads Expands industry-leading silicon IP portfolio of high-performance memory solutions SAN JOSE, Calif. […]
HBM4E Memory: Break Through to Greater Bandwidth
https://go.rambus.com/hbm3-memory-break-through-to-greater-bandwidth#new_tabAI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will […]
High Bandwidth Memory (HBM): Everything You Need to Know
https://www.rambus.com/blogs/hbm3-everything-you-need-to-know/[Updated on March 4, 2026] In an era where data-intensive applications, from AI and machine learning to high-performance computing (HPC) and gaming, are pushing the limits of traditional memory architectures, High Bandwidth Memory (HBM) has emerged as a high-performance, power-efficient solution. As industries demand faster, higher throughput processing, understanding HBM’s architecture, benefits, and evolving role […]
UET-TSS-IP-69 Product Brief
https://go.rambus.com/uet-tss-ip-69-product-brief#new_tabThe UET-TSS-IP-69 is a multi-channel Ultra Ethernet TSS transformation engine providing full line-rate throughput up to 1.6T. It supports all UET-TSS features.
UET-TSS-IP-369 Product Brief
https://go.rambus.com/uet-tss-ip-369-product-brief#new_tabDownload this product brief to learn about the Rambus UET-TSS-IP-369, a multi-channel Ultra Ethernet TSS complete layer solution with rates up to 1.6T.
Rambus Announces Industry-Leading Ultra Ethernet Security IP Solutions for AI and HPC
https://www.rambus.com/blogs/rambus-announces-industry-leading-ultra-ethernet-security-ip-solutions-for-ai-and-hpc/AI/HPC clusters process a tremendous volume of valuable data and have already become a critical element of modern infrastructure and therefore must be protected at all levels that are exposed to potential threats. Network security is one of the key components aiming to provide: Access control – allowing only the authorized nodes or users to […]
Multi-channel Ultra Ethernet TSS Transform Engine (UET-TSS-IP-69)
https://www.rambus.com/security/protocol-engines/uet-tss-ip-69/The UET-TSS-IP-69 (EIP-69) is a high-performance, multi-channel transform engine that provides the complete TSS packet transformation (including KDF and IP/UDP updates), bypass/drop and basic crypto processing at rates up to 1.6Tbps. The engine is designed for integration into the systems that require TSS processing for one or more ports. The engine is provided as separate ingress and egress data paths.
Multi-channel Ultra Ethernet TSS Complete Layer (UET-TSS-IP-369)
https://www.rambus.com/security/protocol-engines/uet-tss-ip-369/The UET-TSS-IP-369 (EIP-369) is an inline, high-performance, multi-channel packet engine that provides the complete TSS layer, bypass/drop and basic crypto processing at rates up to 1.6Tbps.
ZQ Calibration
https://www.rambus.com/chip-interface-ip-glossary/zq-calibration/ZQ Calibration is a process used in DDR (Double Data Rate) SDRAM memory systems—such as DDR3, DDR4, and DDR5—to precisely adjust the on-die termination (ODT) and output driver impedance of the DRAM.
