
Rambus Enables SOCAMM2 Memory Modules for AI Servers
[Last updated on October 13, 2026] Rambus has announced a new power management IC (PMIC) designed for the upcoming LPDDR6 SOCAMM2. Optimized for the dynamic
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[Last updated on October 13, 2026] Rambus has announced a new power management IC (PMIC) designed for the upcoming LPDDR6 SOCAMM2. Optimized for the dynamic

Read this blog to learn how DDR5 DIMM chipsets work, why they matter, how they build upon DDR5 technology, and how emerging module architectures such as MRDIMMs are extending memory bandwidth for demanding AI and data center workloads.

As artificial intelligence workloads evolve from model training to real-time inference and autonomous agentic workflows, the demands placed on system memory continue to rise rapidly.

At Rambus, we spend a lot of time solving hard problems at the intersection of memory and compute. Bandwidth limits. Power integrity. Signal integrity. Thermal

John Eble, Vice President of Product Marketing for Memory Interface Chips at Rambus, recently shared the latest developments on the MRDIMM (Multiplexed Rank DIMM) DDR5

[Last updated on: July 29, 2024] On July 14th, 2021, JEDEC announced the publication of the JESD79-5 DDR5 SDRAM standard signaling the industry transition to DDR5
