Join us on October 28th at Samsung SAFE. We will be participating in talks, “HBM2E Memory Advances AI/ML Training Performance” and “Next-generation displays: An integrated IP solution from Samsung, Hardent, and Rambus.” Abstract and speaker information found below.
Title: HBM2E Memory Advances AI/ML Training Performance
Speaker: Frank Ferro
Abstract: Exponential data growth is driving performance requirements in data centers and networking infrastructure. The industry has responded to this enormous growth in data with new hardware platforms developed for both training and inference applications. But even these new designs are increasingly limited by memory bandwidth, particularly with AI/ML training where the size of models is growing by 10X annually. To remove this bottleneck, Samsung customers need new memory subsystems that significantly expand bandwidth and capacity. HBM2E memory represents the most powerful solution yet to address the AI memory bottleneck. This talk will discuss the new memory systems available in Samsung’s advanced process nodes, along with the design considerations for 2.5/3D memory implementation.
Title: Next-generation displays: An integrated IP solution from Samsung, Hardent, and Rambus
Speaker: Alain Legault, Hardent and Joseph Rodriguez, Rambus
Abstract: Displays for next-generation smartphones, AR/VR devices, and automotive display systems all now require more bandwidth than ever before. Using a combination of VESA Display Stream Compression (DSC) with the MIPI Display Serial Interface (DSI) and Samsung PHY technology offers designers a unique opportunity to achieve display resolutions up to 8K, without having to compromise on display quality, battery life, or cost. Through a series of practical use cases, this presentation will showcase a fully integrated display IP solution from Samsung (PHY), Hardent (VESA DSC Encoder) and Rambus (MIPI DSI-2 Controller).
