Interface IP chip icon

Interface IP

Memory Controllers

Silicon-proven, high-performance memory controller cores are optimized for use in SoCs, ASICs and FPGAs. These market leading solutions for memory interfaces address AI, automotive, data center, network edge, IoT and mobile applications.

Product Product Brief Protocol Application
GDDR6 Controller Download GDDR6 Controller Product Brief  GDDR6 AI, Automotive, Graphics
HBM3 Controller Download HBM3 Controller Product Brief  HBM3 AI, HPC, Data Center, Graphics
HBM2E Controller Download HBM2 Controller Product Brief  HBM2, HBM2E AI, HPC, Data Center, Graphics
LPDDR5 Controller Download LPDDR5 Controller Product Brief  LPDDR5 Mobile, IoT, Automotive
LPDDR4 Controller Download LPDDR4 Controller Product Brief LPDDR4 Mobile, IoT, Automotive
DDR4 Controller Download DDR4 Controller Product Brief DDR4 Data Center, Edge
DDR3 Controller Download DDR3 Controller Product Brief DDR3 IoT, Edge
standards compatible icon

Standards Compatible

Faster time-to-market

Fully verified

flexible options icon

Flexible Design

Full programmability

Customization options

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Reduced Power

Power optimized

Minimum gate count

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Improved Performance

Industry-leading data rates

High memory throughput

Rambus offers a full range of memory controllers and add-on cores
Rambus offers a full range of memory controllers and add-on cores
Download HBM2 and GDDR6: Memory Solutions for AI white paper

HBM2E and GDDR6: Memory Solutions for AI

Artificial Intelligence/Machine Learning (AI/ML) growth proceeds at a lightning pace. In the past eight years, AI training capabilities have jumped by a factor of 300,000 driving rapid improvements in every aspect of computing hardware and software. Meanwhile, AI inference is being deployed across the network edge and in a broad spectrum of IoT devices including in automotive/ADAS. Training and inference have unique feature requirements that can be served by tailored memory solutions. Learn how HBM2E and GDDR6 provide the high performance demanded by the next wave of AI applications.
2.5D/3D Packaging Solutions for AI and HPC

2.5D/3D Packaging Solutions for AI and HPC

For AI and HPC applications, HBM2E memory can deliver excellent bandwidth, capacity and latency in a very compact footprint thanks to its 2.5D/3D structure. The flipside is that this same structure leads to greater design complexity and raises a new set of implementation considerations.