Silicon-proven, high-performance Northwest Logic memory controller cores are optimized for use in SoCs, ASICs and FPGAs. These market leading solutions for memory interfaces address AI, automotive, data center, network edge, IoT and mobile applications.
Minimum gate count
Industry-leading data rates
High memory throughput
For AI and HPC applications, HBM2E memory can deliver excellent bandwidth, capacity and latency in a very compact footprint thanks to its 2.5D/3D structure. The flipside is that this same structure leads to greater design complexity and raises a new set of implementation considerations.
Don’t miss out on the Rambus Design Summit on October 8th!