At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
Designed for server, networking, computing and consumer applications, our DDR4 multi-modal memory PHY is optimized for performance and power efficiency while maintaining full compatibility with industry standard DDR4, DDR3, LPDDR3, and LPDDR2 interfaces. This broad compatibility, combined with support for a wide range of data rates, delivers our customers superior design flexibility and ease of integration.
The DDR4 multi-modal PHY is a DFI 3.1 compliant memory interface that supports both UDIMM and RDIMM modules as well as DRAM–on-motherboard topologies, making it suitable for a broad range of enterprise and consumer applications.
Our silicon-proven PHY consists of a Command/Address (C/A) block, Clock and Power Management block and Data (DQ) macro cells to create a 72 bits wide channel. It is fully characterized and contains all of the necessary components for robust operation and is available in GF 28SLP and SS 28 LPP processes.
The PHY has also undergone extensive design-phase modeling and simulation to ease implementation.
|Protocol||Data Rate (Gbps)||Application|
|DDR3 (1.5V)||800-2133||Consumer Electronics|
|DDR3L (1.35V)||800-1866||Consumer Electronics|
|DDR3U (1.25V)||800-1866||Low-Power Consumer Electronics|
FlexPhase per bit timing adjustment circuits deskew data and clock signals to improve signal integrity and simplify package and PCB system design.
ODT calibration enables higher data rates and superior DRAM device and module performance by establishing the optimal termination value to compensate for variations in process and operating conditions that degrade signal performance.