At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
With their reduced power consumption and industry-leading data rates, our line-up of memory interface IP solutions support a broad range of industry standards with improved margin and flexibility
|Products||Product Brief||Part Number||Application|
|GDDR6 PHY||GDDR6||AI/ML, Automotive, Data Center|
|HBM3 PHY||HBM3||AI/ML, HPC, Data Center|
|HBM2E PHY||HBM2E||AI/ML, HPC, Data Center|
|DDR4 PHY||DDR4, DDR3||Enterprise|
|DDR4 Multi-modal PHY||DDR4, DDR3, LPDDR3, LPDDR2||Enterprise|
|DDR3 PHY||DDR3(1.5V), DDR3L(1.35V)||Consumer|
|LabStation Validation Platform||Comprehensive testing tool||Complex IP Validation|
|On-chip Noise Monitor||Compact noise measurement||Complex IP Characterization|
Flexible packaging options
Improved margin and yield
Improved power efficiency
Lower signaling and stand-by power
Industry-leading data rates
Higher bandwidth and capacity
Our family of memory PHYs offers a number of compelling benefits to chip and system designers alike, including reduced power consumption, increased data rates and improved cost-effectiveness – giving designers the advantage of increased margin and flexibility. These solutions are applicable to a broad range of applications spanning from mobile, to consumer to enterprise.
Rambus PHYs incorporate innovations such as FlexPhase™ timing adjustment circuits, output driver and On Die Termination (ODT) calibration that allow system designers to optimize for their unique requirements.
As part of a complete solution, our PHYs contain all of the necessary components for robust operation and ease of integration. They consist of hard macros of the command/address (C/A) and 8-bit data cells, and include IO pads, phase lock loops (PLL), power mode management (PMM), transmit and receive paths, clock distribution, control logic, power distribution and electrostatic discharge (ESD) protection circuitry. Outside of the PHY itself, our solutions also include complete documentation and access to our in-house experts for optional design integration and bring-up support services to make integration as straightforward as possible.
For AI and HPC applications, HBM2E memory can deliver excellent bandwidth, capacity and latency in a very compact footprint thanks to its 2.5D/3D structure. The flipside is that this same structure leads to greater design complexity and raises a new set of implementation considerations.