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Interface IP

Memory PHYs

With their reduced power consumption and industry-leading data rates, our line-up of memory interface IP solutions support a broad range of industry standards with improved margin and flexibility

DDRn ProductsProduct BriefPart NumberApplication
GDDR6 PHYDownload GDDR6 Product BriefGDDR6AI, Automotive, and Networking
HBM Gen2 PHYDownload HBM2 Product BriefHBM2Enterprise
DDR4 PHYDownload DDR4 Product BriefDDR4, DDR3Enterprise
DDR4 Multi-modal PHYDownload DDR4 Multi-modal PHY Product BriefDDR4, DDR3, LPDDR3, LPDDR2Enterprise
DDR3 PHYDownload DDR3 PHY Product BriefDDR3(1.5V), DDR3L(1.35V)Consumer
LabStation Validation PlatformDownload Labstation Product BriefComprehensive testing toolComplex IP Validation
On-chip Noise MonitorDownload On-chip Noise MonitorCompact noise measurementComplex IP Characterization
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Standards Compatible

Faster time-to-market

Multi-modal functionality

cost-effective icon

Cost Effective

Flexible packaging options

Improved margin and yield

Enhanced testability

Reduced Power

Improved power efficiency

Lower signaling and stand-by power

high-performance icon

Improved Performance

Industry-leading data rates

Higher bandwidth and capacity

Memory IP Solutions

Our family of memory PHYs offers a number of compelling benefits to chip and system designers alike, including reduced power consumption, increased data rates and improved cost-effectiveness – giving designers the advantage of increased margin and flexibility. These solutions are applicable to a broad range of applications spanning from mobile, to consumer to enterprise.

Rambus PHYs incorporate innovations such as FlexPhase™ timing adjustment circuitsoutput driver and On Die Termination (ODT) calibration that allow system designers to optimize for their unique requirements.

R+ DDRn PHY Configuration image

As part of a complete solution, our PHYs contain all of the necessary components for robust operation and ease of integration. They consist of hard macros of the command/address (C/A) and 8-bit data cells, and include IO pads, phase lock loops (PLL), power mode management (PMM), transmit and receive paths, clock distribution, control logic, power distribution and electrostatic discharge (ESD) protection circuitry. Outside of the PHY itself, our solutions also include complete documentation and access to our in-house experts for optional design integration and bring-up support services to make integration as straightforward as possible.

Going Beyond GPUs with GDDR6

Going Beyond GPUs with GDDR6

Supported by Micron Technology, SK Hynix and Samsung, GDDR6 SGRAM will feature a maximum data transfer rate of 16 Gbps, along with an operating voltage of 1.35V. GDDR6 offers higher densities compared to previous-generation graphics memory. In addition, GDDR6 doubles the speed (12–16 Gb/s) of GDDR5 and provides more than 5X the 3.2 Gb/s speed of DDR4. Although initially targeted at game consoles and PC graphics, the latest iteration of GDDR is expected to be deployed across multiple verticals, with Micron specifically highlighting the data center and automotive sector.

Related Markets & Applications

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