32G Multi-protocol SerDes PHY

• Supports data rates of 2.5 to 32 Gbps
• Available in GLOBALFOUNDRIES 22FDX® process node
• Optimized for low-power operation and north/south die-edge placement
• AC-coupled RX front end with on-chip capacitors
• Flexible ASIC interface for sharing impedance codes among multiple PMA hard macros and reducing the number of external reference resistors for impedance calibration
• Duplex lane configurations of x4 and x1
• LC-PLLs provide a wide range of operating frequencies
• Wide range programmable multipliers for reference clock multiplication
• Differential reference clock inputs are selectively sourced from C4 or internal ASIC interface pins
• Flexible ASIC clocking
• Programmable clock outputs from the PLL to the ASIC core
• Parallel data, transmitted to the PMA, synchronized to the transmit parallel data clock from the ASIC core
• Tight lane skew control in the PMA
• Adaptive receive equalizer with programmable CTLE and DFE support
• Support transmit FIR adaptation through back channel for Ethernet applications
• Built-in Self Test (BIST) support
• At-speed functional test capability with low-speed reference clocks
• Built-in PRBS15/31 and custom pattern generation and checking for standalone testing
• Internal serial loopback with optional phase advancing
• Parallel loopback supported within the PMA
• In-situ real-time monitoring and receive data eye schmoo through an adaptive receive sampler
• ATPG Mux Scan support for digital logic
• IEEE 1149.6 JTAG boundary scan for serial link pins
• Multiple interfaces for the access of PMA registers
• Provides direct register control of all PMA functionality, as well as extended features
• Interfaces available for connection to a JTAG TAP controller or through a simple parallel read/write port
• Optional MDIO interface can be provided as required for Ethernet standard PHYs

• PMA hard macro and design kit
  • Verilog models
  • LEF abstracts (.lef)
  • Timing models (.lib)
  • CDL netlists (.cdl)
  • ATPG scan and IEEE 1149.6 AC boundary scan
  • IBIS-AMI models
  • GDSII layout
  • DRC and LVS reports
• Datasheet
• SoC integration guide
• Optional design integration and bring-up support services

Comprehensive chip and system design reviews

• Kickoff/program review
• Floor plan review
• Test/characterization plan review
• Package design review
• Board design review
• Final chip integration review
• Bring-up and test review

 Engineering design services

• Package design
• System board layout
• Statistically-based signal and power integrity analysis