At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
32G C2C SerDes PHY
High-bandwidth, extremely low power SerDes PHY solution for ultra-short reach (USR) and Chip-to-Chip (C2C) 32G interconnects serving next-generation networking and data center applications.
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Product BriefHow the 32G C2C PHY works
The Rambus 32G C2C SerDes PHY (formerly AnalogX AXDieIO) offer the industry’s lowest power, area and latency for operation from 1 to 32 Gbps. The 32G C2C PHY offers a breakthrough power efficiency for channels up to 8dB in die-to-die (D2D) and ultra-short reach implementations. It supports channel loss of up to 16dB with an excellent power efficiency. This power and area optimized IP solution helps designers meet aggressive PPA budgets for next-generation applications.
The PHY supports lane configurations of up to x20 per macro and requires no external components nor special packaging.
This silicon-proven solution is available in advanced FinFET process nodes.
Solution Offerings
- Supports continuous operation up to 32 Gbps
- Industry’s best area, power, and latency in segment
- Channel loss support up to 16dB
- Supports both AC and DC
- Standard two supplies and devices
- Supports any lane configuration up to x20 per macro
- Compatible with several short-reach protocols
- No external components nor special packaging requirements
- Integrates seamlessly with extensive test & configuration software and features
- Available in advanced FinFET process nodes
- Physical layout view (GDSII)
- CDL netlist
- Layout exchange format LEF view
- Liberty timing models (.lib)
- Verilog model and testbenches
- ATPG models
- IBIS-AMI models
- Master configuration software
- Datasheet and application notes
- Integration guides
- Silicon characterization report
Comprehensive Chip and System Design Reviews
- Kickoff/program review
- Floor plan review
- Test/characterization plan review
- Package design review
- Board design review
- Final chip integration review
- Bring-up and test review
Engineering Design Services:
- Package design
- System board layout
- Signal and power integrity analysis
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