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Home > Press Releases > Corporate > Media Alerts > Media Alert – Rambus to Showcase High-speed Memory Technologies and Architectures at IDF 2008

Media Alert – Rambus to Showcase High-speed Memory Technologies and Architectures at IDF 2008

LOS ALTOS, CALIFORNIA, UNITED STATES – 08/19/2008

Who: Rambus Inc. (Nasdaq: RMBS)
Where: Intel Developer Forum
Moscone Center West
800 Howard Street
San Francisco, CA
Booth #712
When: August 19-21, 2008

 

Join Rambus at Intel Developer Forum 2008 for demos and displays of Rambus’ latest technology developments:

  • The Terabyte Bandwidth Initiative, featuring new memory signaling innovations that facilitate data rates of 16Gbps, enables a future memory architecture that can deliver an unprecedented Terabyte per second (TB/s) of memory bandwidth (1 terabyte = 1,024 gigabytes) to a single System-on-Chip (SoC). Innovations include the industry’s first differential signaling for both data and command/address (C/A); FlexLink™ C/A, the industry’s first full-speed, point-to-point C/A link; and 32X Data Rate technology (32 data bits per input clock cycle).
  • Low power signaling technology operating at 6.25Gbps with a power-performance metric of 2.2mW/Gbps.
  • PLAYSTATION®3 (PS3™) open demo board, featuring the XDR™ memory architecture. The Rambus XDR memory interface and FlexIO™ processor bus on the Cell Broadband Engine™ enable an unprecedented aggregate bandwidth of over 65GB/s in the PS3.
  • TI DLP® projector open demo board, featuring the XDR memory architecture. This architecture, including XDR DRAM , XDR memory controller (XMC), XDR IO cell (XIO), and XDR clock generator (XCG), delivers memory bandwidth up to 8.0GB/s in the latest generation of HD front projectors.

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, and Taiwan. Additional information is available at www.rambus.com.

Rambus and the Rambus logo are registered trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.

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