Press Releases Archives

Rambus Enables Next-Generation AI PC Memory with Complete Client Chipset for CUDIMM and CSODIMM Modules

May 26, 2026

SAN JOSE, Calif. – May 26, 2026 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced its complete DDR5 9600 Client Memory Module Chipset for high-performance CUDIMM, CQDIMM and CSODIMM modules in future generation AI PCs. The chipset includes the new Gen2 Client Clock Driver (CKD02), delivering breakthrough performance with support for PC memory module operation of up to 9600 MT/s, Power Management IC (PMIC5120) and Serial Presence Detect Hub (SPD Hub).

Rambus Introduces PCIe® 7.0 Switch IP with Time Division Multiplexing for Scalable AI and Data Center Infrastructure

May 5, 2026

SAN JOSE, Calif. — May 5, 2026 — Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the Rambus PCIe® 7.0 Switch IP with Time Division Multiplexing (TDM), a new addition to its advanced interconnect IP portfolio designed to address the rapidly escalating bandwidth, latency, and scalability requirements of AI, cloud, and high-performance computing (HPC) systems.

Rambus Appoints Sumeet Gagneja as Chief Financial Officer

April 29, 2026

Industry-proven finance leader brings deep semiconductor, data center and AI-driven computing ecosystem expertise to support long-term profitable growth SAN JOSE, Calif., April 29, 2026 — Rambus Inc. (NASDAQ: RMBS) today announced the appointment of Sumeet Gagneja as senior vice president and chief financial officer, effective April 29, 2026. Mr. Gagneja joins Rambus with more than two decades of financial and operational leadership across the semiconductor, data center, and AI-driven computing ecosystem. Mr. Gagneja will oversee the company’s global finance organization,

Rambus Reports First Quarter 2026 Financial Results

April 27, 2026

Achieved strong Q1 results, delivering quarterly product revenue of $88.0 million, up 15% year over year Generated strong quarterly cash from operations of $83.2 million Expanded product and IP offerings for next-generation AI platforms, including the LPDDR5X SOCAMM2 server module chipset, the industry’s fastest HBM4E memory controller IP SAN JOSE, Calif. – April 27, 2026 – Rambus Inc. (NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the first quarter ended

Rambus Enables Power-Efficient AI Platforms with SOCAMM2 Server Module Chipset

April 22, 2026

SAN JOSE, Calif. — Apr. 22, 2026 — Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced a SOCAMM2 (Small Outline Compression Attached Memory Module) chipset designed to enable low-power, high-performance LPDDR5X-based memory modules for AI server platforms.

Rambus Sets New Benchmark for AI Memory Performance with Industry-Leading HBM4E Controller IP

March 4, 2026

Highlights: Built on a proven track record of over one hundred HBM design wins to ensure first-time silicon success Delivers up to 16 Gigabits per second per pin at low latency to meet the demands of next-generation AI and High-Performance Computing (HPC) workloads Expands industry-leading silicon IP portfolio of high-performance memory solutions SAN JOSE, Calif. – March 4, 2026 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the industry’s leading

Victor Peng Joins Rambus Board of Directors

February 12, 2026

SAN JOSE, Calif. – February 12, 2026 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the appointment of Victor Peng to its Board of Directors, effective Thursday, February 12, 2026. Mr. Peng is an accomplished executive with more than 40 years of leadership experience at top semiconductor companies. Most recently, Mr. Peng served as president of Advanced Micro Devices (AMD), leading AMD’s embedded and data center GPU businesses, AI

Rambus Announces Departure of Chief Financial Officer

February 10, 2026

SAN JOSE, Calif. – February 10, 2026 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced that Desmond Lynch, senior vice president and chief financial officer (CFO), will resign from Rambus effective February 27, 2026, to pursue another opportunity. A formal search has commenced for a new CFO. John Allen, current vice president and chief accounting officer at Rambus, will serve as interim CFO and ensure a seamless transition until

Rambus Reports Fourth Quarter and Fiscal Year 2025 Financial Results

February 2, 2026

Achieved record 2025 revenue and earnings results Delivered record quarterly product revenue of $96.8 million, fueling record annual product revenue of $347.8 million, up 41% from 2024 Generated record quarterly and annual cash from operations of $99.8 million and $360.0 million, respectively SAN JOSE, Calif. – February 2, 2026 – Rambus Inc. (NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the fourth quarter ended December 31, 2025. GAAP revenue for the

Rambus Reports Third Quarter 2025 Financial Results

October 27, 2025

Delivered very strong Q3 results and generated excellent quarterly cash from operations of $88.4 million Achieved fourth consecutive quarterly product revenue record at $93.3 million SAN JOSE, Calif. – October 27, 2025 – Rambus Inc. (NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported financial results for the third quarter ended September 30, 2025. GAAP revenue for the third quarter was $178.5 million, licensing billings were $66.1 million, product revenue was $93.3 million, and contract

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