At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
Found 1355 Results
Rambus Partners with Samsung to Develop 56G SerDes PHY on 10nm LPP Process
https://www.rambus.com/rambus-partners-with-samsung-to-develop-56g-serdes-phy-on-10nm-lpp-process/Solution brings scalable ADC-based architecture quickly to networking market, supporting transition to 400GbE Ethernet SUNNYVALE, Calif. – April 20, 2017 – Rambus Inc. (NASDAQ:RMBS) today announced that it is partnering with Samsung Electronics for its recently launched 56G SerDes PHY to be developed on Samsung’s 10nm LPP (Low-Power Plus) process technology. The industry-leading 56G SerDes PHY […]
Rambus Expands Cryogenic Memory Collaboration with Microsoft
https://www.rambus.com/rambus-expands-cryogenic-memory-collaboration-with-microsoft/Companies begin to develop prototype systems that optimize memory performance SUNNYVALE, Calif. – April 17, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced an expanded collaboration with Microsoft researchers to develop prototype systems that optimize memory performance in cryogenic temperatures. Following the initial collaboration announced in December 2015, this new agreement extends joint efforts to […]
Lothian Buses Selects Nevis Technologies as its Smart Ticketing Partner
https://www.rambus.com/lothian-buses-selects-nevis-technologies-as-its-smart-ticketing-partner/New system will offer ITSO-based interoperability roadmap Glasgow, UK – March 16, 2017 – Nevis Technologies today announced that it will deliver its smart ticketing solutions to Lothian Buses, the UK’s largest publicly owned bus company. Nevis Technologies, the joint venture company between Rambus, a leader in smart technology for transportation, and Strathclyde Partnership for […]
Rambus Appoints Two New Fellows
https://www.rambus.com/rambus-appoints-two-new-fellows/Drs. Helena Handschuh and Thomas Vogelsang, authorities in security and memory, join the company’s prestigious Fellow program SUNNYVALE, Calif. – March 14, 2017 – Rambus Inc. (NASDAQ:RMBS) today announced it has appointed Drs. Helena Handschuh, a renowned cryptographer, and Thomas Vogelsang, a world recognized DRAM expert, to one of the company’s highest technical positions, Rambus […]
Rambus Signs License Agreement with Western Digital
https://www.rambus.com/rambus-signs-license-agreement-with-western-digital/New agreement licenses wide use of Rambus inventions in Western Digital Flash products SUNNYVALE, Calif. – March 6, 2017 – Rambus Inc. (NASDAQ:RMBS) today announced it has signed a broad patent license agreement with Western Digital Corporation, a global storage technology and solutions leader. The agreement covers the use of Rambus patented memory technologies, including […]
Rambus Accelerates Mobile Wallet Adoption with Unified Payment Platform
https://www.rambus.com/rambus-accelerates-mobile-wallet-adoption-with-unified-payment-platform/Allows retailers to digitize credit cards, gift cards, loyalty points and coupons into a secure retail wallet for a seamless shopping experience SUNNYVALE, CA, February 27, 2017 – Today Rambus Inc. (NASDAQ: RMBS) announced a comprehensive mobile payments platform to enhance payment security, reduce operational costs and increase revenue for retailers. The Rambus Unified Payment […]
Rambus Introduces High Bandwidth Memory PHY on GLOBALFOUNDRIES FX-14™ ASIC Platform using 14nm LPP Process Technology
https://www.rambus.com/rambus-introduces-high-bandwidth-memory-phy-on-globalfoundries-fx-14-asic-platform-using-14nm-lpp-process-technology/High-performance, power-efficient memory solution designed for today’s data centers SUNNYVALE, Calif. – February 7, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced the availability of its High Bandwidth Memory (HBM) Gen2 PHY developed for GLOBALFOUNDRIES high-performance FX-14TM ASIC Platform. Built on the GLOBALFOUNDRIES 14nm FinFET (14LPP) process technology, the Rambus HBM PHY is aimed at […]
Rambus Unveils 56G SerDes PHYs on Leading-Edge FinFET Technology
https://www.rambus.com/rambus-unveils-56g-serdes-phys/Scalable architecture paves the way for transition to 400GbE Ethernet SUNNYVALE, Calif. – February 1, 2017 – Rambus Inc. (NASDAQ:RMBS) today announced its industry-leading 56G SerDes PHY which delivers enterprise-class performance across the challenging signal environments typical of high-speed communication systems. Developed on cutting-edge second generation FinFET (Fin Field Effect Transistor) process technology, this solution meets […]
Rambus Reports Fourth Quarter and Fiscal Year 2016 Financial Results
https://www.rambus.com/fourth-quarter-and-fiscal-year-2016-financial-results/Business and Financial Highlights: Generated fourth quarter revenue of $97.6 million and annual revenue of $336.6 million; delivered quarter-over-quarter growth across the business Fourth quarter GAAP diluted net loss per share of $0.03; fourth quarter non-GAAP diluted net income per share of $0.16 Executing on buffer chip and SerDes programs with acquired businesses Enabling secure […]
SPT First to Pilot Rambus Ecebs HCE Ticketing
https://www.rambus.com/spt-first-to-pilot-rambus-ecebs-hce-ticketing/Enabling more convenient travel, new program includes a HCE Ticket Wallet Service and Ticketing App for a secure transition from physical to virtual smart cards EAST KILBRIDE, UK – January 25, 2017 – Rambus Ecebs today announced Strathclyde Partnership for Transport (SPT) will initiate a pilot program for the newly announced HCE ticketing solution, which […]
