Writing for Military Embedded Systems, Amanda Harvey notes that stringent size, weight, power and cost (SWaP-C) requirements are influencing nearly every modern military platform. “Everything seems to be getting smaller in the U.S. military arsenal – whether it’s an unmanned aerial vehicle (UAV), an intelligence, surveillance, and reconnaissance (ISR) payload, or a handheld GPS device,” Harvey explained.
Lensless smart sensor technology is SWaP-C friendly
Rambus Appoints Tom Fisher to Its Board of Directors
Oracle executive brings extensive experience in developing cloud-based products and services
SUNNYVALE, Calif. – January 22, 2015 – Rambus Inc. (NASDAQ: RMBS) today announced the appointment of Mr. Ellis Thomas Fisher as a director to its Board, effective immediately. Mr. Fisher is an industry veteran with extensive experience in cloud computing. He is currently senior vice president and chief information officer (CIO) of Global Commercial Cloud Services at Oracle.
“As the market moves to more cloud-based products and services, we felt it was important to round out our Board with this level of knowledge and expertise,” said Mr. Eric Stang, Chairman of the Board at Rambus. “In addition to his extensive experience, Tom brings leadership and perspective that will prove valuable as we continue to execute on our strategic programs. We are pleased to welcome Tom to our Board.”
“The market is moving quickly and clearly cloud-based products and services are set to have a big impact,” noted Fisher. “Rambus is a clear leader in technology development and innovation and I look forward to participating in guiding the organization into the future.”
Prior to joining Oracle, Mr. Fisher served as CIO and vice president of Cloud Computing at SuccessFactors, Inc. where he helped establish the company as a leader in Software as a Service (SaaS) through successful programs. Mr. Fisher spent seven years at Qualcomm where he served as CIO of CDMA Technologies, responsible for developing and delivering the company’s business and engineering solutions. He also served as guest instructor at the UCLA Anderson School of Business as well as the UC-San Diego Grady School of Business. Before Qualcomm, he was vice president and acting chief technology officer (CTO) at eBay, where he was responsible for establishing the company’s technology strategy to support the company’s massive scale and shifting business requirements. Other executive and management roles include serving as chief architect for Gateway Computers and senior manager of Vendor and Software Alliances at IBM. In 2008, Mr. Fisher was honored as San Diego Technology Executive of the Year. Mr. Fisher holds a bachelor of arts degree from the University of North Carolina in Charlotte.
About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.
Press contacts:
Sam Katzen
MSLGROUP
(415) 512-0770
[email protected]
Tezzaron to Incorporate Rambus ReRAM Memory Technology
Architecture enhances power and performance in military, aerospace and commercial applications
SUNNYVALE, Calif. and Naperville, Ill. – January 22, 2015 – Rambus Inc. (NASDAQ:RMBS) and Tezzaron Semiconductor today announced that they have signed an agreement to incorporate Rambus oxide-resistive memory (ReRAM) technology in forthcoming Tezzaron devices. This architecture license gives Tezzaron access to system IP, specifications and validation suites to design differentiated chips using ReRAM, which is ideally suited to improve the power and performance requirements in military, aerospace, and commercial memory applications.
“Rambus is a great company to work with and their ReRAM technology is a game-changer,” said Bob Patti, chief technology officer at Tezzaron. “By implementing ReRAM in our unique 3D architecture, we can revolutionize high-performance computing with better endurance and superior power efficiency.”
“At Rambus we are continually developing comprehensive memory solutions that take into account the evolving needs of an increasingly diverse market,” said Gary Bronner, vice president of Rambus Labs. “ReRAM fills the gap between what DRAM and Flash can provide while being highly reliable and high speed. Collaboration with Tezzaron takes full advantage of this new technology by differentiating the memory architecture for numerous use cases across the embedded landscape.”
Tezzaron plans to build ReRAM into storage-class 3D memory devices for military, aerospace and commercial applications. Tezzaron also plans to implement ReRAM in an assortment of SoCs, FPGAs and processors to exploit the extensive split-fab production experience of Tezzaron’s fabrication subsidiary, Novati Technologies. Using ReRAM, Novati can add hundreds of megabytes of storage to a logic device manufactured in a standard commercial fab.
In addition to military and aerospace applications, ReRAM technology can be utilized in a variety of embedded storage memory devices where low power, design integration, cost and performance are all important factors. Among these, the development of storage memory in connected devices is fast becoming critical.
The first in Tezzaron’s family of ReRAM devices is currently in design and is scheduled for production in 2016.
Follow Rambus
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
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About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.
About Tezzaron Semiconductor
Tezzaron is a full service turn-key supplier of 3D and 2.5D memory, memory subsystems and memory-intensive SoCs. Tezzaron specializes in 3D wafer and die stacking, TSV processes and wide-ranging collaborations, creating commercial parts as well as custom devices for prototyping and production. For more information, visit www.Tezzaron.com.
About Novati Technologies
Novati Technologies, a wholly owned subsidiary of Tezzaron, is the premier innovation partner for accelerating nanotechnology development and commercialization. Novati’s proven advanced technology and secure IP infrastructure, combined with its recognized Technology Development Process, supports companies developing MEMS, microfluidics, novel transistors, photovoltaics and other nanotechnologies for the semiconductor, life sciences and aerospace and defense markets. For more information, visit www.Novati-Tech.com.
Press contacts:
Sam Katzen
MSLGROUP for Rambus
(415) 512-0770
[email protected]
Tezzaron licenses Rambus ReRAM
Rambus and Tezzaron Semiconductor have clinched an agreement to incorporate Rambus oxide-resistive memory (ReRAM) technology in upcoming Tezzaron devices. According to Rambus Labs VP Gary Bronner, the architecture license grants Tezzaron access to system IP, specifications and validation suites to design differentiated chips using ReRAM.
Are stacked die creating new security risks?
Writing for Semiconductor Engineering, Ernest Worthman notes that while stacked die may improve performance and lower power, the use of through-silicon vias (TSVs) could potentially add new security risks. “With 2.5D architectures, IP blocks can be designed on separate dies and assembled using an interposer. Such a chip can have a stacked DRAM, a Wi-Fi radio and flash memory, together with the processor in a single package,” Worthman explained.
Rambus Unveils On-chip Noise Monitor to Improve Quality and Reduce Time-to-Market of Complex SoCs
Compact IP enables accurate characterization of power supply noise in mobile and server applications
SUNNYVALE, Calif. – January 20, 2015 – Rambus Inc. (NASDAQ:RMBS) today announced the addition of an On-chip Noise Monitor to its suite of tools and IP cores. The Noise Monitor is a compact IP block that enables easy and precise noise measurements for both low-power mobile and high-performance server SoCs. Embedded on-chip, the noise monitor eliminates the need to use slow and often error-prone hand-probing techniques, improving the quality of silicon test results and speeding time-to-market.
“As the system requirements for smartphones, tablets and servers continue to drive higher data rates and reduced power, designers are facing increasingly difficult challenges to accurately measure and characterize SoC power supply noise,” said Kevin Donnelly, general manager of the Memory and Interface division at Rambus. “The fast and accurate results delivered by the On-chip Noise Monitor provide designers a better understanding of the affects of noise and circuit performance and an increased confidence in the quality of IC design.”
The Noise Monitor is an extremely small IP block that is integrated directly into the complex IC capable of measuring noise at frequencies as high a 6 gigahertz (GHz). This makes it ideal for high data rate applications, as well as those that use package-on-package and 2.5/3D packaging. When coupled with the Rambus LabStation™ Validation Platform, designers are able to precisely measure multiple aspects of power supply noise using only the LabStation Interface Module (LIM) and a personal computer.
Rambus will be demonstrating the On-chip Noise Monitor along with its R+™ enhanced standard memory and serial link cores at the upcoming DesignCon 2015 conference in booth 835, January 28-29, 2015.
Follow Rambus
Follow Rambus
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc
About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.
