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Home > Press Releases > Interface IP > Controllers > 2015

2015

eSilicon, Northwest Logic and SK Hynix create high-bandwidth memory (HBM) hardware demonstration

SAN JOSE, Calif. — September 10, 2015 — eSilicon Corporation, Northwest Logic and SK Hynix today announced they have created a fully working HBM hardware demonstration. This demonstration uses an advanced FPGA containing Northwest Logic’s HBM Controller Core and FPGA-based HBM PHY and SK Hynix HBM devices. eSilicon packaged the FPGA and HBM devices on an organic interposer. This demonstration is further indication that HBM is ready to be used by the market to implement a wide variety of high-performance, bandwidth-intensive designs. It also demonstrates the ability of eSilicon, Northwest Logic and SK Hynix to support HBM-based designs.

HBM is a JEDEC standard that utilizes “2.5D” packaging. The HBM device consists of a stacked memory array. This array is connected to an ASIC via a silicon or organic interposer. First-generation HBM devices provide eight channels of 128-bit data running at one Gbit/s/pin for a total system throughput of 128 Gbytes/s. Second-generation HBM devices double the throughput. This is approximately 14 times the throughput available from a DDR4 DIMM running at 2,600 Mbits/pin. HBM has both power and cost advantages over competing technologies.

eSilicon Corporation is a leading independent semiconductor design and manufacturing solutions provider, including full service ASIC support for front- and back-end design, custom IP, packaging, test and volume manufacturing. This particular demonstration used a fine-pitch organic interposer. eSilicon also supports packaging of HBM devices with a silicon interposer. “HBM and system-in-package technology hold great promise to break the power and performance bottlenecks designers are currently facing with regard to memory subsystems,” said Bill Isaacson, senior director, product marketing at eSilicon. “This joint effort with Northwest Logic and SK Hynix validates that HBM is ready to enter mainstream use.”

Northwest Logic’s HBM Controller Core supports both Gen 2 (2 Gbit/s/pin) and Gen 1 (1 Gbit/s/pin). The core supports a range of user interfaces and operational modes include Gen 2 pseudo-channel support. As part of this demonstration, Northwest Logic created a complete FPGA design including the HBM Controller Core and FPGA PHY and memory test support.  This design provided error-free writes and reads to the HBM device.

“We are excited to collaborate with eSilicon and SK Hynix to show a fully working HBM demonstration,” commented Brian Daellenbach, president of Northwest Logic, Inc. “We are seeing increasing interest in HBM applications. This demonstration shows that eSilicon, Northwest Logic and SK Hynix have the capabilities needed to enable a customer to implement an HBM ASIC.”

“HBM utilizes the latest advancement in DRAM packaging and through-silicon via technologies to enable system designers to extract the maximum value in terms of performance and power efficiency from the DRAM memory subsystem.  SK Hynix is in the forefront of bringing the HBM device to the industry and anticipates adoption in multiple major market segments,” said Kevin Tran, senior manager of technical marketing at SK Hynix.

About eSilicon

eSilicon guides customers through a fast, accurate, transparent, low-risk ASIC journey, from concept to volume production. Explore your options online with eSilicon STAR tools, engage with eSilicon experts, and take advantage of eSilicon semiconductor design, custom IP and IC manufacturing solutions through a flexible engagement model. eSilicon serves a wide variety of markets including the communications, computer, consumer, industrial products and medical segments. Get the data, decision-making power and technology you need for first-time-right results. www.esilicon.com

The right chip. Right now™

About Northwest Logic

Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express solution (PCI Express 3.0, 2.1 and 1.1 cores and drivers), Memory Interface Solution (DDR4/3/2, LPDDR4/3/2 SDRAM; HBM, MRAM, RLDRAM 3/II), and MIPI Solution (CSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs. For additional information, visit www.nwlogic.com.

About SK Hynix Inc.

SK Hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips (“NAND Flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK Hynix is available at www.skhynix.com.

Contacts:

[ezcol_1third]Sally SlemonseSilicon Corporation408-635-6409sslemons@esilicon.com[/ezcol_1third] [ezcol_1third]Vinitha SeevaratnamNorthwest Logic503-533-5800 x308www.nwlogic.com[/ezcol_1third] [ezcol_1third_end]Kevin TranSK Hynix408-232-8386www.skhynix.com[/ezcol_1third_end]

Northwest Logic Offers MRAM Controller IP compatible with Everspin’s ST-MRAM

Northwest Logic’s MRAM Controller Core is validated with Everspin’s EMD3D064M, expanding the ST-MRAM ecosystem to enable low latency and high reliability storage systems

Beaverton, OR – Feb 9, 2015 – Northwest Logic, a leading high-performance IP provider, and Everspin Technologies, Inc., the world’s leading developer and manufacturer of discrete and embedded Magnetic RAM “MRAM”, announces the full interoperability between Northwest Logic’s MRAM Controller Core and Everspin Technologies’ ST-MRAM devices. This interoperability is hardware proven on a Xilinx Virtex-7 FPGA platform and is now available for designs needing low-latency, high memory throughput using MRAM technology.

Everspin’s ST-MRAM technology provides high performance, non-volatile RAM which is designed for storage and network markets. Everspin’s ST-MRAM combines the speed and endurance of DRAM with the non-volatility of Flash and is also interface compatible with DDR3 SDRAM. Everspin offers the world’s first commercially-available Spin Torque MRAM and a roadmap of ST-MRAM solutions that meets tomorrow’s storage system requirements. ST-MRAM from Everspin gives designers of high performance storage systems the ability to achieve ultra low latency, increase reliability with high cycling endurance, and protect data in the event of power loss.

“The combination of Everspin’s EMD3D064M DDR3 ST-MRAM and Northwest Logic’s MRAM Controller Core provides storage and memory system designers a new level of capability to have critical cache and in-flight data inherently protected,” said Scott Emley, Vice President of Marketing at Everspin. “We are very pleased that Northwest Logic, as a key Memory Controller IP provider, is now supporting ST-MRAM. This is a key enabler for our customers to use ST-MRAM in their designs.”

Northwest Logic, a key IP provider in the semiconductor market, provides a complete array of high performance Memory Interface Solutions for ASIC and FPGA applications. “We are glad to be working with Everspin to demonstrate a complete end-to-end MRAM system,” said Brian Daellenbach, President of Northwest Logic. “Our MRAM Controller Core supports Everspin’s ST- MRAM devices and is fully available for applications requiring high memory throughput, high clock rates and full programmability. The core also supports interfacing to DDR3 SDRAM.”

About Northwest Logic

Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including PCI Express solution (PCI Express 3.0, 2.1 and 1.1 cores, DMA cores and DMA drivers), Memory Interface Solution (DDR4/3/2, LPDDR4/3/2 SDRAM; HBM, MRAM, RLDRAM 3/II), and MIPI Solution (CSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs. For additional information, visit www.nwlogic.com.

About Everspin Technologies

Everspin Technologies is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-Torque MRAM (ST-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount. With over 40 Million MRAM and ST-MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world. With an intellectual property portfolio of more than 500 active patents and applications, Everspin leads the market in development of both in-plane and perpendicular magnetic tunnel junction (MTJ) ST-MRAM bit cells. Everspin has established high-quality manufacturing worldwide, along with enabling a full turn-key 300mm high-volume foundry partner for advanced technology nodes including 40nm, 28nm and beyond. In addition to launching discrete memory solutions with new densities and advanced interfaces, including the world’s first commercialization and volume shipments of ST-MRAM, Everspin is delivering on the company’s strategy to proliferate MRAM and ST-MRAM as mainstream embedded memories for use in MCUs, GPUs, DSPs, Application Processors, and ASICs, earning Everspin its description as “The MRAM Company”.   www.everspin.com

Northwest Logic Contact:
Vinitha Seevaratnam
Product Marketing Engineer
(503) 533-5800
www.nwlogic.com

Everspin Contact:
Michael Schoolnik
Story Public Relations
415-674-3816
Michael@storypr.com

 

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