At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
Found 3640 Results
Rambus Reports Second Quarter Financial Results
https://www.rambus.com/rambus-reports-second-quarter-financial-results/Business and Financial Highlights Signed comprehensive license agreement with Qualcomm for innovative memory, interface and security technologies Unveiled CryptoManager™ secure feature management platform with Qualcomm as lead customer Generated quarterly revenue of $76.5 million Quarterly GAAP diluted net income per share of $0.04 Quarterly non-GAAP diluted net income per share of $0.16 SUNNYVALE, Calif. – […]
Why is HCE Perfect for Australia?
https://www.rambus.com/blogs/why-is-hce-perfect-for-australia/Learn how HCE reinforces Australia to launch their mobile payments services and become first-movers within their market.
Is the U.S. Finally Getting Smart about Payment Technology?
https://www.rambus.com/blogs/is-the-us-finally-getting-smart-about-payment-technology/It took the hacking of 70 million Target credit cards for Congress to abandon the unsecure magnetic-stripe cards used by most Americans and setting a deadline for the new smart card technology.
Bell ID Joins Mobey Forum
https://www.rambus.com/bell-id-joins-mobey-forum/Offers HCE Expertise To Global Industry Association Token management specialist, Bell ID, has become a member of Mobey Forum, joining other industry players in empowering banks to take the lead in mobile money. As a new Associate Member, Bell ID will lend its expertise in host card emulation (HCE) to the work of the association’s Business […]
Rambus to Present at MLOVE ConFestival
https://www.rambus.com/rambus-to-present-at-mlove-confestival/MLOVE ConFestival, Berlin, Germany – June 25, 2014 Who: Rambus Inc. (NASDAQ:RMBS) Where: MLOVE ConFestival 2014 Schloss Beesenstedt, Germany When: June 25–27, 2014 At the fifth annual MLOVE ConFestival taking place in Berlin, Germany, Rambus Chief Marketing Officer Jerome Nadel will discuss the Internet of Things architecture during the “Smart City and Internet of Things” […]
Rambus to Present at the 2014 Computational Optical Sensing and Imaging Meeting
https://www.rambus.com/rambus-to-present-at-the-2014-computational-optical-sensing-and-imaging-meeting/COSI, Kohala Coast, HI – June 23, 2014 Who: Rambus Inc. (NASDAQ:RMBS) Where: Computational Optical Sensing and Imaging (COSI) 2014 The Fairmont Orchid Kohala Coast, HI When: June 24, 2014 Rambus inventors will lead three sessions at the Computational Optical Sensing and Imaging (COSI) Conference taking place in Kohala Coast, Hawaii on June 24, 2014. […]
Building a Foundation for Strong Ecosystem Partnerships
https://www.rambusblog.com/2014/06/23/building-a-foundation-for-strong-ecosystem-partnerships/#new_tabRambus has spent the better part of the last two years evolving as a company. Having started with Rambus in January 2012, I can personally attest to how this evolution has positively impacted our culture, mindset, and strategy. Our external focus and the level of collaboration with both customers and industry peers has increased exponentially […]
Building a Foundation for Strong Ecosystem Partnerships
https://www.rambus.com/blogs/building-a-foundation-for-strong-ecosystem-partnerships-2/Written by Joe Gullo Rambus has spent the better part of the last two years evolving as a company. Having started with Rambus in January 2012, I can personally attest to how this evolution has positively impacted our culture, mindset, and strategy. Our external focus and the level of collaboration with both customers and industry […]
Controllers Newsletter – Q2 2014
https://www.rambus.com/controllers-newsletter-q2-2014/Northwest Logic Releases PCI Express Solution For Kintex UltraScale Northwest Logic, a Xilinx Premier IP partner, now offers full PCI Express support for Xilinx Kintex UltraScale devices. This support includes Northwest Logic’s high-performance DMA Cores with AXI4 streaming and memory-mapped interfaces for both endpoint and root-port applications. These cores have been fully validated in hardware […]
Where is Interconnect Technology Heading?
https://www.rambusblog.com/2014/06/18/248/With 16nm chips moving to production this year, companies are actively developing the 10nm and 7nm technology nodes. These generations are interconnect heavy with more than 50% of their cost due to Back-End-Of-Line (BEOL) wiring levels, and designs that are dominated by interconnect delay. Qualcomm’s VP of Technology, Geoffrey Yeap, in fact, called BEOL performance/area/cost […]
