Bell ID at Cartes America and Cards & Payments Australasia

As specialists in host card emulation and cloud mobile payments, Bell ID is delighted to be attending two premier events on the payment solutions calendar.

Bell ID Appoints Michelle Lehouck as U.S. EMV Product Director

Bell ID is pleased to announce the appointment of Michelle Lehouck as EMV Product Director for its U.S. division. As the U.S. migration to EMV chip technology gains momentum, Michelle will be responsible for maintaining and expanding Bell ID’s EMV activity in the region by offering even greater on-the-ground support to the company’s expanding U.S. […]

Mobility as a Catalyst for Change

From the first time I attended an MLOVE ConFestival in 2010, through each subsequent event, I have been continually impressed with the quality of individuals that attend, the companies those individuals represent and the innovations they create. As a group, MLOVE attendees are passionate about invention and inventing “things.” They continuously question the techniques of […]

Achronix Announces PCI-SIG® Compliance for Hardened PCI Express on Speedster22i FPGAs

Santa Clara, Calif., May 6, 2014 – Achronix Semiconductor Corporation today announced that its 22nm Speedster22i devices have achieved PCI-SIG® compliance with the PCI Express® (PCIe®) 3.0 Specification for x8 lanes. The Speedster22i devices successfully passed the PCI-SIG Compliance and Interoperability Tests at the PCI-SIG workshop and are now included in the PCI-SIG integrators list. […]

Mobility as a Catalyst for Change

From the first time I attended an MLOVE ConFestival in 2010, through each subsequent event, I have been continually impressed with the quality of individuals that attend, the companies those individuals represent and the innovations they create. As a group, MLOVE attendees are passionate about invention and inventing “things.” They continuously question the techniques of […]

Future Proof Your Network: EMV, Mobile & Cloud are Here

Rambus to Present Innovative Mobile Memory Technology at Linley Tech Mobile Conference 2014

Session will focus on advanced memory solutions in fast-growth mobile device markets Santa Clara, Calif. – April 30, 2014 Who: Rambus Inc. (NASDAQ: RMBS) Where: Linley Tech Mobile Conference 2014 Santa Clara, Calif When: April 30- May 1, 2014 At the Linley Tech Mobile Conference 2014, Rambus Director Ajay Jain will participate in a session […]

DINI Group Verifies Compatibility of Northwest Logic’s PCI Express Cores with Virtex-7 ASIC Prototyping Platforms

April 29, 2014 – Northwest Logic and DINI Group announced today that Northwest Logic’s PCI Express® (PCIe®) 3.0 solution, including the Expresso 3.0 Core (PCI Express 3.0 Controller Core) has been validated on DINI Group’s 1, 2, and 4-FPGA ASIC prototyping platforms. This validation was done with 4 lanes running at 5 Gbit/s SERDES rates. […]

Nevis Technologies shortlisted for Prestigious Award

April 2014 Nevis Technologies shortlisted for Prestigious Award – Rambus Ecebs and SPT joint venture partnership proves a hit – Nevis Technologies has been recognised for its innovative, collaborative approach in delivering the technology which drives the new Subway Smartcard, introduced in Glasgow recently. The joint venture company which is a partnership of Rambus Ecebs […]

International Patent Pending for Secure Element in the Cloud

Bell ID Secure Element in the Cloud is now a patent pending solution with the World Intellectual Property Organization.