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XDR DRAM Passes 50 Million Units Shipped Milestone

Award-winning memory architecture delivers superior bandwidth performance for advanced computing and consumer electronics applications

LOS ALTOS, CALIFORNIA, UNITED STATES – 03/31/2008 – Rambus Inc. (NASDAQ:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip architectures, today announced that its customers have shipped over 50 million XDR™DRAM devices worldwide.

The award-winning XDR memory architecture features key enabling technologies built on patented Rambus innovations that include low-voltage, low-power Differential Rambus Signaling Level (DRSL); Octal Data Rate (ODR) technology that transfers eight bits of data each clock cycle; FlexPhase™ circuit technology for precise on-chip alignment of data with clock; and Dynamic-Point-to-Point (DPP) for both enhanced signal integrity and scalability.

“The demand for high-performance, cost-effective memory solutions continues to grow dramatically,” said Yoshitaka Kinoshita, officer for the Digital Consumer Division of Elpida Memory, Inc. “Thanks to the XDR memory architecture, Elpida can provide our customers superior DRAM products enabling amazing new capabilities.”

Proven in high-volume, cost-competitive applications, the XDR memory architecture operating at 4.8Gbps provides an unmatched 9.6GB/s of peak memory bandwidth with a single, 2-byte wide XDR DRAM. With a roadmap extending to 8.0Gbps providing 16.0 GB/s of bandwidth per device, XDR DRAM provides an order of magnitude higher performance than today’s standard memories. With XDR DRAM, designers can achieve unprecedented performance with the fewest devices.

“The XDR memory architecture is an ideal solution for advanced consumer and computing applications,” said Sharon Holt, senior vice president of worldwide sales, licensing and marketing at Rambus. “Our complete XDR memory solution and comprehensive engineering services minimize risk and help our customers bring breakthrough products to market.”

Recent milestones from XDR DRAM licensees include the October 2007 introduction of the industry’s fastest DRAM, the 512 Megabit (Mb), 4.8Gbps XDR DRAM by Elpida Memory Inc., providing an industry-leading data transfer rate of 9.6 Gigabytes per second (GB/s) with a single device. In addition, Qimonda AG has started shipping samples of its 512Mb XDR DRAM.

For more information on the XDR memory architecture please visit www.rambus.com/xdr.

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip architectures. Since its founding in 1990, the Company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.

*Winner of the International Engineering Consortium (IEC) 2008 DesignVision Award in the Semiconductors and ICs (IP) category. The IEC DesignVision Awards recognize technologies, applications, products, and services judged to be the most unique and beneficial to the industry.

Rambus and the Rambus logo are registered trademarks of Rambus Inc. XDR is a trademark of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.

Rambus XDR™ Memory Architecture Named 2008 DesignVision Winner

Memory architecture receives honors from prestigious International Engineering Consortium

LOS ALTOS, CALIFORNIA, UNITED STATES – 02/05/2008 – Rambus Inc. (NASDAQ: RMBS), one of the world’s premier technology licensing companies specializing in high-speed memory architectures, is pleased to announce that the International Engineering Consortium (IEC) has chosen the Rambus XDR™ memory architecture as the winner in the 2008 DesignVision Awards category for Semiconductors and ICs (IP). The IEC DesignVision Awards recognize technologies, applications, products, and services judged to be the most unique and beneficial to the industry.

“This year’s winners exemplify the highest level of innovation in today’s industry,” commented IEC Executive Vice President Roger Plummer. “We are pleased to congratulate Rambus for its XDR memory architecture, which received the 2008 DesignVision Award this week at DesignCon 2008.”

“We take great pride in advancing the state-of-the-art in innovative memory architectures and are honored to be recognized by the IEC,” said Kevin Donnelly, senior vice president of Engineering at Rambus. “The XDR architecture is a total memory system solution that enables blazing fast speeds with the fewest devices, making it ideal for computing and consumer electronics applications.”

Rambus recently announced that Toshiba has taken a license for the XDR memory architecture for its next-generation HDTV chipsets. In addition, Qimonda has begun shipping its first samples of XDR DRAM, and Elpida has begun shipping 4.8GHz XDR memory, the world’s fastest production DRAM.

Key components enabling the breakthrough performance of the XDR memory architecture are:

  • The XDR DRAM, a high-speed memory IC that turbo-charges standard CMOS DRAM cores with a high-speed interface capable of 4.0 GHz data rates providing up to 8 GB/s of bandwidth with a single device.
  • The XIO controller IO cell providing the same high-speed signaling capability found on the DRAM, but adding additional enhancements like FlexPhase™ technology that optimizes timing and eliminates the need for trace length matching.
  • The XMC memory controller, a fully synthesizable logical memory controller that is optimized to take advantage of innovations like Dynamic Point-to-Point which provides for capacity expansion while delivering the signal integrity benefits of point-to-point signaling.
  • The XCG clock generator providing the system clocks with four programmable outputs, guaranteed to meet the clocking requirements for the XIO and XDR DRAM devices.

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.

Rambus and the Rambus logo are registered trademarks of Rambus Inc. XDR and FlexPhase are trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.

Toshiba Licenses Rambus XDR Memory Architecture for HDTV Chipset

Next-generation HDTVs to use 4.8Gbps XDR DRAM

LOS ALTOS, CALIFORNIA, UNITED STATES – 12/17/2007 – Rambus Inc. (NASDAQ:RMBS), one of the world’s premier technology licensing companies specializing in high-speed memory architectures, today announced that Toshiba Corporation has licensed its XDR™ memory controller interface cell (XIO) and XDR memory controller (XMC) for next-generation high-definition television (HDTV) chipsets. The XIO and XMC will be implemented in Toshiba’s 65nm process. Operating at 4.8Gbps, the XDR memory architecture will allow Toshiba’s HDTV chipset to deliver state-of-the-art image processing performance in its customers’ HDTVs.

“HDTVs now require as much memory bandwidth as many PCs in order to deliver the advanced features consumers demand,” said Hideki Moriyama, Deputy General Manager of the System LSI Division at Toshiba’s Semiconductor Company. “With the XDR memory architecture, we are able to achieve both superior performance and a reduced bill of materials for our customers’ HDTV applications.”

The XDR memory architecture uses patented Rambus innovations such as Octal Data Rate (ODR) technology, Differential Rambus Signaling Level (DRSL), and FlexPhase™ circuits to deliver the highest bandwidth available while using fewer DRAM devices than industry-standard memory solutions. Higher memory performance as delivered by the XDR architecture enables the advanced features of next-generation HDTVs such as 1080p+ resolution, 120Hz refresh rates, 12-bit color, multiple full HD Picture-in-Picture (PiP) data streams, and advanced image enhancement algorithms.

“As a leading supplier of chipsets to HDTV manufacturers Toshiba delivers an exceptional viewing experience for consumers,” said Sharon Holt, senior vice president of sales, licensing and marketing at Rambus Inc. “With the XDR memory architecture, we’re able to meet the growing demands for bandwidth in an exciting new generation of consumer electronics products.”

Proven in high-volume and cost-competitive applications, Rambus solutions are backed by comprehensive engineering support services that range from chip design to system integration. XDR DRAM licensees include Elpida Memory Inc., Qimonda AG, and Samsung Electronics Co. Ltd. For more information about the XDR memory architecture, as well as the next-generation XDR2 DRAM with micro-threading, please visit www.rambus.com/xdr.

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.

Rambus and the Rambus logo are registered trademarks of Rambus Inc. XDR and FlexPhase are trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.

Elpida Introduces The World’s Fastest DRAM Based On The Rambus XDR Memory Architecture

4.8GHz XDR DRAM achieves 6x performance increase over industry-standard DDR2 DRAMs

LOS ALTOS, CALIFORNIA, UNITED STATES and TOKYO, JAPAN – 10/04/2007 – Elpida Memory, Inc. (Elpida) (Tokyo Stock Exchange Code 6665), Japan’s leading global supplier of Dynamic Random Access Memory (DRAM) and Rambus today introduced the industry’s fastest DRAM, the 512 Megabit (Mb), 4.8GHz XDR™ DRAM, based on Rambus’ XDR memory architecture. This latest addition to the XDR DRAM family provides an industry-leading data transfer rate of 9.6 Gigabytes per second (GB/s) with a single device, making it an ideal choice for high-performance, high-volume applications such as high-definition televisions (HDTV), gaming consoles, PCs, servers and workstations.

“The industry’s demand for memory bandwidth in next-generation products is growing rapidly as high-definition image data becomes more popular,” said Yoshitaka Kinoshita, officer for the Digital Consumer Division of Elpida Memory, Inc. “Working with Rambus on XDR DRAM, we can provide the most cost-effective, high-bandwidth memory solution to our customers.”

Elpida’s 512Mb, 4.8GHz XDR DRAM (Part number: EDX5116ADSE-5E-E) device is organized in 8-banks (x16/x8/x4 programmable), and with a 9.6GB/s data transfer rate delivers six times the peak bandwidth of industry-standard DDR2-800 memory devices. The 4.8GHz XDR device is manufactured using Elpida’s 70 nm process technology and is available in a 104-ball FBGA package. To support both high-speed and robust data transfer, XDR DRAM utilizes key enabling technologies built on patented Rambus innovations such as Differential Rambus Signaling Level (DRSL), which minimizes signal swing and noise; Octal Data Rate (ODR) technology which transfers eight bits of data on each clock cycle to achieve 4.8GHz operation with just a 600MHz clock; and FlexPhase™ circuit technology for precise on-chip data alignment with the clock. The 512Mb XDR DRAM device also features adaptive impedance matching, dynamic request scheduling and zero overhead refresh.

“Elpida’s 4.8GHz XDR DRAM is an excellent fit for consumer electronics applications requiring high bandwidth for 3-D graphics, high-definition image processing, and advanced multimedia,” said Sharon Holt, senior vice president of worldwide sales, licensing and marketing at Rambus. “Elpida is well established as a leading XDR DRAM supplier and we are proud to work with them to advance the roadmap for XDR to 4.8GHz, achieving the world’s fastest DRAM.”

XDR DRAM is an integral part of the XDR memory architecture, working seamlessly with the XDR Memory Controller (XMC), XDR IO controller interface cell (XIO), and the XDR Clock Generator (XCG) to enable unprecedented levels of memory performance while utilizing the fewest number of ICs. A single XDR DRAM device operating in x16 mode achieves a data transfer rate of 9.6GB/s. In comparison, it requires six DDR2-800 x16 devices to achieve an equivalent data rate.

Proven in high-volume applications, Rambus XDR memory solutions are backed by comprehensive engineering support services that range from chip design to system integration. XDR DRAM continues to provide an order of magnitude higher performance than today’s standard memories. For more information on the XDR memory architecture, as well as the next-generation XDR2 DRAM with micro-threading, please visit www.rambus.com/xdr.

Availability

Elpida’s 512Mb 4.8GHz XDR DRAM devices (Part number: EDX5116ADSE-5E-E) will be available for sampling in December 2007. Volume production is expected to begin in April 2008. A datasheet is available upon request.

About Elpida Memory, Inc.

Elpida Memory, Inc., (Tokyo Stock Exchange Code 6665), is a leading manufacturer of Dynamic Random Access Memory (DRAM) silicon chips. Our design, manufacturing, and sales operations are backed by our world class technology expertise. Our manufacturing facilities, Hiroshima Elpida Memory, Inc. (front-end processes) and Akita Elpida Memory, Inc. (back-end processes), utilize the most advanced manufacturing technologies available in the industry. Further, we have customer sales and marketing support offices in Japan, North America, Europe, Taiwan, Hong Kong and Singapore. Elpida’s portfolio of advanced products features such characteristics as high-density, high-speed, low power and small packing profiles. We provide applications across a wide range of areas, including high-end servers, mobile phones and digital consumer electronics. For more information about Elpida, please visit http://www.elpida.com.

About Rambus Inc.

Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip architectures. Since its founding in 1990, the Company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.

Rambus and the Rambus logo are registered trademarks of Rambus Inc. XDR and FlexPhase are trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.

Industry Ships 25 Million XDR™ DRAM Memory Devices

XDR DRAM enables unprecedented performance in high-volume and cost-sensitive systems

LOS ALTOS, CALIFORNIA, UNITED STATES – 06/11/2007 – Rambus Inc. (NASDAQ:RMBS), one of the world’s premier technology licensing companies specializing in high-speed memory architectures, today announced that its customers have shipped over 25 million XDR™ DRAM (extreme data rate dynamic random access memory) devices worldwide. Designed for both high-bandwidth and cost-sensitive systems, XDR DRAM and the XDR memory architecture are ideally suited for graphics processing, consumer electronics, network and server applications, as well as a new generation of compute platforms driven by multi-core processors. XDR DRAM is the high-performance memory solution in Sony’s breakthrough PLAYSTATION®3 (PS3™) computer entertainment system.

According to Nam Kim, research director at iSuppli Corporation, “The XDR memory architecture with its underlying inventions is a key element in creating the rich graphics seen in the Sony PS3 and could lend itself to future graphics-intensive applications such as HDTV.”

The XDR memory architecture operating at 4.0GHz provides an unmatched 8.0 GB/s of peak memory bandwidth with a single, 2-byte wide XDR DRAM. XDR DRAM works seamlessly with the XDR Memory Controller (XMC), XDR IO controller interface cell (XIO), and the XDR Clock Generator (XCG) to enable unprecedented levels of memory performance while utilizing the fewest number of ICs. With a roadmap extending to 8.0GHz providing 16.0 GB/s of bandwidth per device, XDR DRAM continues to provide an order of magnitude higher performance than today’s standard memories.

“The market is demanding higher performance memory solutions to satisfy the needs of multi-core processing and other compute-intensive applications,” said Sharon Holt, senior vice president of Sales, Licensing, and Marketing at Rambus. “The XDR memory architecture, coupled with our engineering services, gives our customers a competitive advantage in both performance and time-to-market.”

The XDR memory architecture features key enabling technologies built on patented Rambus innovations that include low-voltage, low-power Differential Rambus Signaling Level (DRSL); Octal Data Rate (ODR) technology that transfers eight bits of data each clock cycle; FlexPhase™ circuit technology for precise on-chip alignment of data with clock; and Dynamic-Point-to-Point (DPP) for both enhanced signal integrity and scalability.

Proven in high-volume and cost-competitive applications, Rambus solutions are backed by comprehensive engineering support services that range from chip design to system integration, and can scale for future cost reduction. For more information on the XDR memory architecture, as well as the next generation of XDR, the 8GHz XDR2 DRAM with patented micro-threading, please visit www.rambus.com/xdr. XDR DRAM licensees include Elpida Memory Inc., Qimonda AG, and Samsung Electronics Co. Ltd.