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At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.

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Challenges and Solutions for Future Main Memory

Download “Challenges and Solutions for Future Main Memory”

DDR3 SDRAM is used in many computing systems today and offers data rates of up to 1600Mbps. To achieve performance levels beyond DDR3, future main memory subsystems must attain faster data rates while maintaining low power, high access efficiency and competitive cost. This whitepaper will outline some of the key challenges facing next generation main memory and the Rambus innovations that can be applied to advance the main memory roadmap.

frog and IXDS explore the future of lensless smart sensors (LSS)

Rambus’ lensless smart sensor (LSS) technology took center stage at a recent summit in San Francisco co-hosted by frog San Francisco and IXDS from Berlin. This event represented the culmination of several months of intense design innovation collaboration between Rambus and its “Partners in Open Development (POD).” In this context, they worked together to conceive and develop functional prototype product design concepts based on LSS hardware and software.

Memory price dip to spur DDR4 adoption

KitGuru’s Anton Shilov reports that DDR4 prices have dropped approximately 25% since late June. “According to DRAMeXchange, the world’s leading computer memory tracker, one 4Gb DDR4 chip rated to run at 2133MHz cost $3.618 on the spot market on the 28th of June 2015,” he explained.

Designing lightweight cryptography for the IoE

Ernest Worthman of Semiconductor Engineering recently noted that we have entered an age where technology is expected to do more, faster, anonymously, and often invisibly. “It’s supposed to use less power, with smaller footprints, unobtrusively and intuitively,” he explained. “And all that needs to be protected with cryptography.”

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