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Rambus and SK Hynix Sign Patent License Agreement

Agreement settles all outstanding disputes

SEOUL, KOREA and SUNNYVALE, CALIFORNIA, – 06/11/2013 — Rambus Inc. (NASDAQ:RMBS), the innovative technology solutions company, and SK Hynix, the world’s top tier memory semiconductor supplier, today announced they have signed a five-year patent license agreement for the use of Rambus memory-related patented innovations in SK Hynix semiconductor products and have also settled all outstanding claims. The agreement includes a license to certain DRAM products for payments of $12 million per quarter for the next five years. Other terms of the agreement are confidential.

“This is a milestone agreement for both companies that puts years of legal disputes behind us and gives us the opportunity for collaboration,” said Dr. Ron Black, president and chief executive officer at Rambus. “With this agreement, we can focus more on engaging with the industry as we work on future challenges where we can bring invention and value to the market with superior solutions and products.”

Rambus management will host a conference call today at 2:00pm PT to discuss this agreement and settlement. The call will be available online at investor.rambus.com. A replay will be available following the call on the Rambus Investor Relations website for one week at the following numbers: (855) 859-2056 (domestic) or (404) 537-3406 (international) with ID# 94783491.

About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media. Additional information is available at www.rambus.com.

About SK Hynix Inc.
SK Hynix Inc., Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips (“NAND Flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK Hynix is available at www.skhynix.com.

Rambus Adds Color Temperature Change Capability to Family of Revolutionary LED Bulbs

In-lamp adjustment allows end users to choose color temperature with a turn of the dial

SUNNYVALE, CALIFORNIA, UNITED STATES – 06/10/2013 – Rambus Inc. (NASDAQ: RMBS), the innovative technology solutions company that brings invention to market, today introduced a revolutionary capability for in-lamp adjustment of color temperature in its LED-based PAR30 and BR30 bulbs. This technology development comes following the general release of the Rambus PAR30 and BR30 bulbs, and continues the company’s momentum in bringing its portfolio of LED bulbs to market.

Since LEDs are available in a series of color that cross the spectrum of white, there is a high degree of variation of color temperatures in lamps that are available to the consumer, making it difficult to blend new LED bulbs with existing lighting. With a simple turn of a dial on the bulb, this innovative technology cost effectively enables in-lamp color temperature change through the use of a remote phosphor and a color mixing light guide, without requiring additional LEDs or expensive multi-channel drivers.

The Rambus in-lamp color adjustment technology allows the end user to continuously adjust color temperature to create the desired environment, from cool white of 5,000 kelvin to warm white of 3,000 kelvin, and all points in between. In the commercial sector, this technology enables simplified SKU management and is scalable to meet changing needs. Retailers need only one bulb on the store shelf to cover all the different color options that consumers require.

“We are excited to add more revolutionary capabilities to our LED bulb product portfolio. The ability for the end user to control and update the color temperature of their bulbs is unique within the lighting industry,” said Jeffery Parker, president of the Lighting and Display Technology group at Rambus. “Whether it’s a consumer, distributor, store owner or facility manager, this new capability means users can purchase the bulb today without worrying about replacing it later if their color temperature needs change.”

Rambus is currently accepting commercial requests for its PAR30 and BR30 bulbs, which are expected to be generally available in Q3 of this year. For additional information on Rambus’ wide-range of lighting innovations, please visit: www.rambus.com/bulb.

About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media.

Rambus Signs Comprehensive Agreement with STMicroelectronics

SUNNYVALE, CALIFORNIA, UNITED STATES – 06/17/2013 — Rambus Inc. (NASDAQ:RMBS), the innovative technology solutions company that brings invention to market, today announced it has signed a license agreement with STMicroelectronics (NYSE: STM). The agreement expands the ST relationship with CRI, furthering its adoption of DPA countermeasures into multimedia chipsets and accelerating its broad support for CryptoFirewall core technology.

In addition, the agreement provides ST with access to Rambus’ memory and interface technologies for inclusion in any ST products as well as exploration of further opportunities for collaboration. The companies have also settled all outstanding claims, including pending disputes related to Rambus’ patented innovations.

“We are pleased to have reached this agreement with ST, a global leader in the semiconductor industry,” said Dr. Ron Black, president and chief executive officer, Rambus. “Covering multiple Rambus divisions, this agreement exemplifies our ability to add value across ST’s product lines, and we look forward to ongoing collaboration with the ST team.”

As a result of the agreement, ST will expand deployment of CRI’s differential power analysis (DPA) countermeasures and CryptoFirewall security core technology across a wide range of its semiconductor products. The agreement also covers the use of Rambus’ patented memory interface and serial link innovations. Additionally, Rambus will have access to ST’s Fully Depleted Silicon On Insulator (FD-SOI) process technology design environment, enabling Rambus to benefit from reduced silicon geometries and lower power consumption at 28nm and below in its future Memory and Interface solutions.

Other terms of the agreement are confidential.

About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media. Additional information is available at rambus.com.

Rambus Ecebs receives new ITSO certification for its latest Contactless & Dual Interface Smart Cards

June 2013

– New cards can provide unrivalled ITSO product storage capability

Rambus Ecebs have been awarded ITSO certification for two members of its card family “Pearl” and “Diamond”.
Pearl, a contactless only smart card can hold at least twice as many ITSO products as the contactless platform (DESFire) and is therefore capable of holding tickets with a higher need for info storage such as those found on rail where customers may make multi-leg journeys or hold seat reservation information. The silicon platform for the Pearl card is provided by Infineon technologies.  It is a highly secure device used widely in the banking industry, which makes the Pearl card a secure choice for online transactions such as those used in ITSO part 11 implementations like Rambus Ecebs Paragon RTD solution. Security is especially relevant for high value transactions.

The Diamond card, which has also received its ITSO certificate, provides a ‘one size fits all’ card offering. This card offers all of the features provided by the Pearl card including the Infineon platform but as a dual interface device also comes with an EMV payment application meaning it can be used in schemes which are both ITSO and EMV based. The Diamond card is being used by a number of Rambus Ecebs customers including Nevis Technologies for the Glasgow Subway, which is due to go live during 2013. Both cards come with MIFARE legacy support and also have significant card memory left over to offer even more ITSO application space if required in addition to a wide range of additional applications such as Lasseo, ID, loyalty etc.

Both cards can be remotely updated, meaning changes required after the cards have been issued can be made, maximising the potential of the card post issuance.

Russell McCullagh, Rambus Ecebs Managing Director added, “with Pearl we have brought a card to market that will avoid a customer’s card running out of space to store their products. As more and more smart card transport schemes emerge and more commercial products are available, this will provide consumers with a better customer experience. With Diamond we have also added EMV payment meaning the card can be used on a wider basis, creating a wider appeal and experience for the travelling public.”

Bell ID Launches Secure Element in the Cloud

New solution reduces the complexities and cost of delivering mobile NFC services

Global provider of token management software, Bell ID, has launched Secure Element (SE) in the Cloud to simplify the provisioning of near-field-communication (NFC) based mobile services. The solution manages keys, certificates and NFC credentials in a secure remote environment rather than in the mobile device, providing application issuers with the independence and control to manage their credentials without the need for third party involvement.

Bell ID’s SE in the Cloud software has already been commercially deployed. It provides the functionality to complete (EMV payment) transactions through a remote SE using a standard contactless terminal and acceptance infrastructure. When a consumer makes a transaction, their NFC credential is accessed from the remote cloud SE after which the appropriate command is generated and sent back through the mobile device to the point-of-sale terminal. The data is presented in the same format as that used in standard card-present transactions. The solution can also pre-authorize payments, allowing consumers to make transactions even when a connection to the server cannot be established.

David Orme, CEO at Bell ID, comments: “By moving the SE from a physical device to a remote environment, application issuers are able to directly provision their applications to an SE. This enables them to take full control of their relationship with the customer and ensure a consistent brand and user experience across all available channels and services.”

The direct access offered by the new software to the SE also supports instant fraud detection and allows immediate blocking of an application when necessary. Additionally, having the SE in the cloud increases computing power and storage in comparison to a physical SE. This provides more options regarding advanced on-device risk management, as well as the ability to support virtually any number of NFC services.

Pat Curran, Executive Chairman at Bell ID, concludes: “With our SE in the Cloud software, we offer an easy, affordable and flexible alternative to the complex deployment models used in today’s NFC marketplace. This makes mobile NFC services accessible to a much wider audience, including banks, service providers, mobile network operators, payment processors and card personalization bureaus. We believe this is the next breakthrough in the adoption of mobile NFC services, which is already proven by the high demand for this solution from our customer base.”

For more information, please visit our Secure Element in the Cloud page.

 

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