
The Thermal Challenges of Moore’s Law: Part 2
In part one of this two-part blog series, Semiconductor Engineering editor in chief Ed Sperling spoke with Steven Woo, Rambus fellow and distinguished inventor, about

In part one of this two-part blog series, Semiconductor Engineering editor in chief Ed Sperling spoke with Steven Woo, Rambus fellow and distinguished inventor, about

Semiconductor Engineering editor in chief Ed Sperling spoke with Steven Woo, Rambus fellow and distinguished inventor, about the relationship between Moore’s Law, Dennard scaling and

Today’s encryption methods are generally broken down into two types: symmetric and asymmetric. Symmetric encryption relies on the sender and receiver to have identical, secret

In part 5 of this series, we discussed the most common memory systems that are used in the highest performance AI applications. These include on-chip

In part four of this series, we took a closer look at the Roofline model, a modern computer architecture tool that illustrates how applications like
In part three of this series, we discussed how a Roofline model can help system designers better understand if the performance of applications running on
