AI & Machine Learning
AI Accelerates HBM Momentum
In a recent EE Times article, Gary Hilson notes that high bandwidth memory (HBM) deployments are becoming more mainstream due to the massive growth and
February 3, 2022
At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
CXL
How Rambus is Making Data Faster and Safer in 2022 and Beyond
Throughout 2021 and early 2022, Rambus has continued to make data faster and safer with the launch of key products, industry initiatives, and strategic partnerships. To address the insatiable demand for more bandwidth in the data center, we announced our 8.4 Gbps HBM3-Ready Memory Subsystem, confirmed the sampling of our DDR5 5600 MT/s 2nd-generation RCD
January 27, 2022
HBM and GDDR6
Delivering Terabyte-Scale Bandwidth with HBM3-Ready Memory Subsystem
An exponential rise in data volume, and the meteoric rise of advanced workloads like AI/ML training, requires constant innovation in all aspects of computing. Memory bandwidth
September 16, 2021
AI & Machine Learning
Rambus Design Summit Featured Speaker: Frank Ferro
Thanks to everyone who joined us for Rambus Design Summit 2021. Over the coming weeks we’ll highlight the webinars and panels from the event all
August 13, 2021
HBM and GDDR6
HBM2E data rate: Now up to 4 Gbps (20% Increase)
Joseph Rodriguez, senior product marketing engineer for IP cores at Rambus, has written an article for Semiconductor Engineering that explores the company’s recent achievement of
June 30, 2021
AI & Machine Learning
Stacking memory for AI/ML training with HBM2E
Frank Ferro, Senior Director Product Management at Rambus, recently penned an article for Semiconductor Engineering that takes a closer look at high bandwidth memory (HBM)
May 6, 2021
