At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
Rambus is, once again, leading the way in memory performance solutions with today’s announcement that the Rambus GDDR6 PHY now reaches performance of up to
Semiconductor Engineering Editor in Chief Ed Sperling recently spoke with Frank Ferro, Senior Director of Product Management at Rambus, about accelerating AI/ML applications in the
Rambus Fellow, Steven Woo, returns to the Rambus Design Summit stage tomorrow, and we are so excited for his keynote: Advancing Computing in the Accelerator
In a recent EE Times article, Gary Hilson notes that high bandwidth memory (HBM) deployments are becoming more mainstream due to the massive growth and
Throughout 2021 and early 2022, Rambus has continued to make data faster and safer with the launch of key products, industry initiatives, and strategic partnerships. To address the insatiable demand for more bandwidth in the data center, we announced our 8.4 Gbps HBM3-Ready Memory Subsystem, confirmed the sampling of our DDR5 5600 MT/s 2nd-generation RCD
An exponential rise in data volume, and the meteoric rise of advanced workloads like AI/ML training, requires constant innovation in all aspects of computing. Memory bandwidth
