At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
AI training data sets continue to grow and require accelerators that support terabyte-scale bandwidth. Offering a high memory bandwidth and power-efficient solution, HBM3 has become
As AI continues to grow in reach and complexity, the unrelenting demand for more memory requires the constant advancement of high-performance memory IP solutions. We’re
Rambus is, once again, leading the way in memory performance solutions with today’s announcement that the Rambus GDDR6 PHY now reaches performance of up to
Semiconductor Engineering Editor in Chief Ed Sperling recently spoke with Frank Ferro, Senior Director of Product Management at Rambus, about accelerating AI/ML applications in the
Rambus Fellow, Steven Woo, returns to the Rambus Design Summit stage tomorrow, and we are so excited for his keynote: Advancing Computing in the Accelerator
In a recent EE Times article, Gary Hilson notes that high bandwidth memory (HBM) deployments are becoming more mainstream due to the massive growth and
