Join us at D&R IP SoC Silicon Valley on April 24, 2025! To register and learn more about the event, click here: https://www.design-reuse-embedded.com/dr-embedded/ipsocdays/2025/SiliconValley/
Unleashing the Performance of AI Training with HBM4
Abstract: AI training models are growing in both size and sophistication at a breathtaking rate, requiring ever greater bandwidth and capacity. With its unique 2.5D/3D architecture, HBM4 can deliver Terabytes per second of bandwidth and unprecedented capacity in an extremely compact form factor. Join Kevin Yee from Samsung and Nidish Kamath from Rambus discuss the design considerations of HBM4 memory subsystems (PHY, Memory Controller, and Packaging) in next-generation AI SoCs.
Speakers: Kevin Yee, Sr. Director of IP and Ecosystem Marketing, Samsung Foundry; Nidish Kamath, Director of Product Management for Memory Interface IP, Rambus
Meeting Automotive Design, Safety and Security Challenges with an Integrated HSM Solution
Abstract: The automotive industry is undergoing a transformative shift towards the software-defined vehicle (SDV) bringing a broad set of implementation challenges. Revolutionary approaches are needed to navigate the ever-increasing complexity, support faster time-to-market demands, and meet regulatory safety and security compliance. Join Raj Uppala of Rambus as he discusses an innovative integrated HSM solution that combines synthesizable Hardware Security Module (HSM) hardware IP with pre-integrated, pre-validated HSM software to meet the needs of automotive OEM and SoC developers.
Speaker: Raj Uppala, Senior Director of Marketing & Partnerships, Rambus
