Join Rambus at FMS25! We will be in booth #645 with our partners, ZeroPoint Technologies. Stop by and chat with us about our CXL IP solutions. In addition, we will have a demo video showcasing our CXL 3.0 Controller IP with XpressAGENT in the CXL Consortium booth #725. Nidish Kamath, Director of Product Management at Rambus, will also be participating in two talks, “3D DRAM Technology Now and Future,” and “High Performance DRAM Technology.” Scroll on to see session information and abstracts below.
DRAM-301-1: 3D DRAM Technology Now and Future
When: Thursday, August 7th at 8:30AM
Where: Ballroom E (Santa Clara Convention Center, First Floor)
Organizer: Ju Jin An, Senior Technical Staff Member, IBM
Presenters: Tom Hsu, Analyst, TrendForce;; Suyash Walkunde, Staff Engineer, Samsung Semiconductor India; Nidish Kamath, Director – Product Management, Rambus; Benjamin Vincent, Director Engineering, Lam Research
Presentation Session Description:
This session explores the forefront of memory technology advancements with a focus on High Bandwidth Memory (HBM) and its pivotal role in meeting the increasing demands of AI and semiconductor applications. The presentations converge on the innovative strides being made in HBM, emphasizing the transition to more complex stacking configurations—8hi to potentially 20hi—enabled by cutting-edge techniques like TSV and hybrid bonding. With an eye on enhancing bit density and packaging efficiency, the talks highlight the criticality of thermal, latency, and power characterization, underscoring the importance of architecture in optimizing performance. The discussions also delve into the implications of 2.5D and 3D architectures, especially in the context of AI SoCs, where HBM4 is poised to redefine bandwidth capabilities. Complementary to these developments is the evolution in DRAM technology, as it embraces three-dimensional designs through nanosheet transistors and innovative patterning strategies, promising further integration and efficiency. Attendees will gain a comprehensive understanding of how these advancements collectively drive the future of memory technologies, addressing the needs of burgeoning AI models and semiconductor innovations.
DRAM-303-1: High Performance DRAM Technology
When: Thursday, August 7th at 12:10PM
Where: GAMR-1 & 2 (Great America Meeting Rooms, SCCC 2nd Floor)
Organizer: Ju Jin An, Senior Technical Staff Member, IBM
Presenters: Khayam Anjam, Sr Systems Performance Engineer, Micron; Henrique Potter, Sr. Systems Performance Engineer, Micron Technologies; Nidish Kamath, Director – Product Management, Rambus; Igor Sharovar, Chief Technology Officer, Truememorytechnology LLC
Presentation Session Description:
In a rapidly evolving technological landscape, the search for efficient, high-performance memory solutions has never been more critical, as highlighted by recent advancements in memory technologies. This session explores the intersection of power efficiency and performance enhancement across various high-demand environments, from data centers to edge computing. Presentations showcase the transformative potential of Low-Power DDR memory, as exemplified by the NVIDIA GH200 platform, which integrates LPDDR5X to optimize power and performance in high-performance computing (HPC) workloads. Similarly, the emergence of Multiplexed Rank DIMMs (MRDIMMs) addresses the growing memory bandwidth demands posed by AI and real-time analytics, offering substantial improvements in latency and scalability despite their power requirements. Furthermore, the transition to GDDR7 memory, developed collaboratively by Rambus and Cadence, provides a pathway for handling the escalating bandwidth needs of AI/ML inference models at the edge. Finally, the innovative IO-DIMM architecture presents a compelling alternative to traditional PCIe and CXL interfaces, delivering low-latency, power-efficient near-memory processing suitable for AI and real-time data applications. Together, these advancements underscore a common theme: the relentless pursuit of memory technologies that not only meet the demands of modern applications but also push the boundaries of power efficiency and performance.
We hope to see you there! If you would like to set up some time to meet at the show, we invite you to submit a request here.
About FMS25
FMS: the Future of Memory and Storage has expanded the scope of Flash Memory Summit to encompass all tiers of Memory and Storage. As a leading global independent conference and exhibition, FMS is now in its 19th year, offering enhanced support to the industry. Serving as a centralized hub for professional growth, industry connections, and customer engagement, FMS provides a comprehensive platform for all stakeholders in the field.
To learn more and register for the event, follow the link here: https://futurememorystorage.com/
