At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
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iRunway report highlights seminal Rambus patents
https://www.rambus.com/blogs/irunway-report-highlights-seminal-rambus-patents-2/A recent iRunway report on the semiconductor memory landscape ranked Rambus in the fourth position of the top ten seminal patent holders in DRAM technology. “In order to determine which patents are seminal iRunway analyzed 63,000 granted patents out of the more than 80,000 IP assets in the sector,” writes Richard Lloyd of iam-Magazine. “It […]
Jerome Nadel to talk smart cities @ MWC 2015
https://www.rambus.com/blogs/jerome-nadel-to-talk-smart-cities-mwc-2015-2/On March 3rd, Rambus CMO Jerome Nadel will participate in 4YFN’s MWC 2015 panel discussion about the Internet of Things (IoT), smart sensors and the evolution of smart cities. Additional 4YFN panelists include Cisco CTO John Baekelmans, MLOVE Founder and Curator Harald Neidhardt, Intel Human Computer Interaction Expert Mara Balestrini and D4SC Designer-Founder Priya Prakash. […]
Mobile DRAM industry valued at over $3.6 billion
https://www.rambus.com/blogs/mobile-dram-industry-valued-at-over-3-6-billion-2/DRAMeXchange, a division of TrendForce, recently confirmed worldwide mobile DRAM revenue of US$3.607 billion in the fourth quarter of 2014 – representing 27.8% of DRAM industry value and a 4.2% quarterly increase. In addition, mobile DRAM made up nearly 40% of all DRAM shipments. According to DRAMeXchange assistant VP Avril Wu, mobile memory’s average selling […]
From GDDR to HBM
https://www.rambus.com/blogs/from-gddr-to-hbm-2/A recent KitGuru report suggests AMD has designed its upcoming Radeon R9 380X with high bandwidth memory, or HBM, a next-gen stacked DRAM memory standard. Read first our primer on: HBM2E Implementation & Selection – The Ultimate Guide » “Although HBM provides DDR3 – like bit rate per pin (HBM1=1GHz, HBM2=2GHz), the standard more than […]
U.S. DoD eyes 3D printing
https://www.rambus.com/blogs/u-s-dod-eyes-3d-printing-2/Writing for Military Embedded Systems, Editorial Director John McHale confirms 3D printing has made its way into the military embedded computing realm, with suppliers exploiting the technology to accelerate production and reduce development costs. “They can save thousands of dollars by printing heat sinks, connectors, components and even printed circuit boards,” he explained. “The Department […]
Will authentication evolve beyond the basics?
https://www.rambus.com/blogs/will-authentication-evolve-beyond-the-basics-2/Writing for The Guardian, journalist Andy Meek questions if increasing cyber attacks ultimately mean the end of username and password security. “The username and password has long been the basic set of authentication credentials that grants access into computer and web-based systems and networks,” he explains. “But in light of recent data breaches, at least […]
R+ DDR4/3 PHY developed on Samsung’s 28nm LPP process
https://www.rambus.com/blogs/r-ddr43-phy-developed-on-samsungs-28nm-lpp-process-2/Rambus has officially confirmed that its R+™ DDR4/3 PHY was developed using Samsung’s 28nm LPP process. “Our ongoing collaboration with Samsung has yielded a robust, production-ready R+ DDR4/3 PHY on the power-performance optimized 28nm Low Power Plus (LPP) process,” Loren Shalinsky, a Strategic Development Director at Rambus, explained. “The Rambus design has been characterized at […]
Rambus Develops R+™ DDR4/3 PHY on Samsung 28nm LPP Process
https://www.rambus.com/rambus-develops-r-ddr43-phy-on-samsung-28nm-lpp-process/Design achieves both high-performance and high-efficiency for networking, computing, and consumer applications SUNNYVALE, Calif. – February 10, 2015 – Rambus Inc. (NASDAQ:RMBS) today announced it has developed an R+™ DDR4/3 PHY on the Samsung 28nm LPP process. Through the collaboration with Samsung, Rambus has achieved a robust, production-ready R+ DDR4/3 PHY on the power-performance optimized […]
Understanding the supply chain security conundrum
https://www.rambus.com/blogs/understanding-the-supply-chain-security-conundrum-2/Writing for Semiconductor Engineering, Ernest Worthman describes the challenge of securing chips as a “foot race” between the good and bad guys. “Going forward, expect heavily funded, grouped efforts to place tremendous pressure on security envelopes,” Worthman explains. “This includes everything from simple home devices, such as routers, to the most critical infrastructures, such as […]
Northwest Logic Offers MRAM Controller IP compatible with Everspin’s ST-MRAM
https://www.rambus.com/northwest-logic-offers-mram-controller-ip-compatible-everspins-st-mram/Northwest Logic’s MRAM Controller Core is validated with Everspin’s EMD3D064M, expanding the ST-MRAM ecosystem to enable low latency and high reliability storage systems Beaverton, OR – Feb 9, 2015 – Northwest Logic, a leading high-performance IP provider, and Everspin Technologies, Inc., the world’s leading developer and manufacturer of discrete and embedded Magnetic RAM “MRAM”, announces […]
