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A recent KitGuru report suggests AMD has designed its upcoming Radeon R9 380X with high bandwidth memory, or HBM, a next-gen stacked DRAM memory standard. Read first our primer on: HBM2E Implementation & Selection – The Ultimate Guide » “Although HBM provides DDR3 – like bit rate per pin (HBM1=1GHz, HBM2=2GHz), the standard more than […]
Writing for Military Embedded Systems, Editorial Director John McHale confirms 3D printing has made its way into the military embedded computing realm, with suppliers exploiting the technology to accelerate production and reduce development costs. “They can save thousands of dollars by printing heat sinks, connectors, components and even printed circuit boards,” he explained. “The Department […]
Writing for The Guardian, journalist Andy Meek questions if increasing cyber attacks ultimately mean the end of username and password security. “The username and password has long been the basic set of authentication credentials that grants access into computer and web-based systems and networks,” he explains. “But in light of recent data breaches, at least […]
Rambus has officially confirmed that its R+™ DDR4/3 PHY was developed using Samsung’s 28nm LPP process. “Our ongoing collaboration with Samsung has yielded a robust, production-ready R+ DDR4/3 PHY on the power-performance optimized 28nm Low Power Plus (LPP) process,” Loren Shalinsky, a Strategic Development Director at Rambus, explained. “The Rambus design has been characterized at […]
Design achieves both high-performance and high-efficiency for networking, computing, and consumer applications SUNNYVALE, Calif. – February 10, 2015 – Rambus Inc. (NASDAQ:RMBS) today announced it has developed an R+™ DDR4/3 PHY on the Samsung 28nm LPP process. Through the collaboration with Samsung, Rambus has achieved a robust, production-ready R+ DDR4/3 PHY on the power-performance optimized […]
Writing for Semiconductor Engineering, Ernest Worthman describes the challenge of securing chips as a “foot race” between the good and bad guys. “Going forward, expect heavily funded, grouped efforts to place tremendous pressure on security envelopes,” Worthman explains. “This includes everything from simple home devices, such as routers, to the most critical infrastructures, such as […]
Northwest Logic’s MRAM Controller Core is validated with Everspin’s EMD3D064M, expanding the ST-MRAM ecosystem to enable low latency and high reliability storage systems Beaverton, OR – Feb 9, 2015 – Northwest Logic, a leading high-performance IP provider, and Everspin Technologies, Inc., the world’s leading developer and manufacturer of discrete and embedded Magnetic RAM “MRAM”, announces […]
Writing for Electronics 360 (IHS), Peter Clarke reports that Rambus has signed up customers for its metal-oxide based resistive RAM technology (ReRAM). “[For example, Rambus] signed an architectural license with Tezzaron Semiconductor Corp. (Naperville, Illinois), a supplier of 3D and 2.5D memory, memory subsystems and memory-intensive SOCs,” said Clarke. “Tezzaron is expected to build storage-class […]
The Raspberry Pi 2 – which made its debut earlier this week – packs a 900MHz quad-core ARM Cortex-A7 processor and 1GB of RAM (LPDDR2 SDRAM). Additional key specs include four USB ports, 40 GPIO pins, HDMI output, an Ethernet jack, 3.5mm audio jack and microSD card slot According to Joel Hruska of Extreme Tech, […]
February 2015 Rambus Ecebs were delighted to welcome a large number of companies and people involved in smart ticketing in the UK to our event in the Strangers Dining Room in the Palace of Westminster which was sponsored by the Right Honourable Michael McCann, the Rambus Ecebs local MP. Rambus Ecebs strengthens its position as […]
