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Rambus Announces Pricing of $150 Million Convertible Senior Notes Offering
https://www.rambus.com/rambus-announces-pricing-of-150-million-convertible-senior-notes-offering/SUNNYVALE, Calif. — November 14, 2017 — Rambus Inc. (NASDAQ: RMBS) today announced the pricing of its offering of $150 million aggregate principal amount of its 1.375% Convertible Senior Notes due 2023 (the “notes”) in a private placement to qualified institutional buyers pursuant to Rule 144A under the Securities Act of 1933, as amended (the […]
Rambus teams with eftpos for Android Pay in Australia
https://www.rambus.com/rambus-teams-with-eftpos-for-android-pay-in-australia/Token Service Provider technology secures mobile payments for Australia’s largest debit card system SUNNYVALE, CA and MELBOURNE, Australia – Nov. 13, 2017 – Today Rambus Inc. (NASDAQ: RMBS) announced that eftpos, the Australian domestic debit network, is using the Rambus Token Service Provider (TSP) technology to securely digitize payment cards to support Android Pay. The […]
Rambus Announces Proposed $150 Million Convertible Senior Notes Offering
https://www.rambus.com/rambus-announces-150-million-convertible-senior-notes-offering/SUNNYVALE, Calif. — November 13, 2017 — Rambus Inc. (NASDAQ: RMBS) today announced its intention to offer, subject to market conditions and other factors, $150 million aggregate principal amount of its convertible senior notes due 2023 in a private placement to qualified institutional buyers pursuant to Rule 144A under the Securities Act of 1933, as […]
Rambus Collaborates with Samsung Canada and Interac to Help Deliver Samsung Pay in Canada
https://www.rambus.com/rambus-helps-deliver-samsung-pay-in-canada/Tokenization allows Canadian cardholders to make secure mobile payments SUNNYVALE, Calif. – Nov. 1, 2017 – Today Rambus Inc. (NASDAQ: RMBS), a leader in digital security, semiconductor and IP products and services, announced that it has teamed with Samsung Canada and Interac Association / Acxsys Corporation, the organizations behind Canada’s leading payment brand, to help enable Interac Debit on Samsung Pay in […]
Rambus Reports Third Quarter 2017 Financial Results
https://www.rambus.com/third-quarter-2017-financial-results/Revenue of $99.1 million, up 10% year over year GAAP diluted net income per share of $0.07; non-GAAP diluted net income per share of $0.19 Announced industry’s first silicon-proven server DIMM buffer chipset capable of achieving the speeds expected for next-generation DDR5 Teamed up with eftpos domestic debit card network in Australia to support roll […]
Rambus Validates Interoperability of DDR4 High-performance Memory IP Solution for Arm-based Datacenter Systems
https://www.rambus.com/rambus-validates-interoperability-of-ddr4-for-arm-based-datacenter-systems/Rambus DDR4 3200 PHY, Arm CoreLink Dynamic Memory Controller provide comprehensive solution for datacenter and communications SUNNYVALE, Calif. – Oct. 19, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced the validated interoperability of the Rambus DDR4 PHY and the Arm® CoreLink™ DMC-620 Dynamic Memory Controller. Together, these IP blocks offer speeds of up to 3200 Mbps, […]
Rambus, eftpos Team Up in Australia to Support Apple Pay
https://www.rambus.com/rambus-eftpos-team-up-to-support-apple-pay/SUNNYVALE, Calif. – Oct. 17, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced it has teamed up with eftpos, the Australian domestic debit network, to help support secure transactions with Apple Pay for users in Australia. Through integration with the Rambus Token Service Provider (TSP) technology, eftpos is able to support Apple Pay, the easy, secure and […]
Rambus Delivers High-Speed SerDes Interface Solutions on GLOBALFOUNDRIES FX-14™ ASIC Platform for Data Center and Enterprise
https://www.rambus.com/rambus-delivers-serdes-solutions-on-globalfoundries-fx-14-asic-platform/Suite of silicon-proven PHYs on 14nm LPP process technology maximize performance and flexibility SUNNYVALE, Calif. – Oct. 12, 2017 – Rambus Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP products, today announced the availability of a suite of silicon-proven, high-speed SerDes solutions including 16G MPSL (multi-protocol serial link), 30G C2C (chip-to-chip) and 30G VSR (very […]
Rambus Announces Industry’s First Functional Silicon of Server DIMM Buffer Chipset Targeted for Next-generation DDR5
https://www.rambus.com/rambus-announces-next-gen-ddr5/Provides data center architects early path to next-generation memory speeds SUNNYVALE, Calif. – Sept. 20, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced functional silicon of a double data rate (DDR) server DIMM (dual inline memory module) buffer chipset prototype for the next generation DDR5 memory technology. This represents a key milestone for Rambus and the industry’s […]
Rambus and Northwest Logic Certify Interoperability of HBM2 Interface Solution for High-performance Networking and Data Center Applications
https://www.rambus.com/rambus-and-northwest-logic-certify-interoperability-of-hbm2-interface-solution-for-high-performance-networking-and-data-center-applications/Integrated HBM2 PHY and Memory Controller provide validated, standards-compliant memory subsystem with superior signal integrity and reliability SUNNYVALE, Calif. – Aug. 23, 2017 – Rambus Inc. (NASDAQ: RMBS), an innovator in semiconductor and IP products, today announced validated interoperability between its HBM2 PHY and Northwest Logics’ HBM2 Memory Controller Core. The solution builds on the growing ecosystem […]

