Rambus’s Cryptography Research Division (CRD) has entered into a partnership with Microsemi to resell a number of advanced security technologies developed by the DPA product engineering team at CRD. According to Michael Mehlberg, Senior Director of Business Development for Government Solutions at Rambus CRD, a recently signed reseller agreement includes both the DPA WorkStation™ and DPA Resistant Suite B cryptographic cores.
Blog
DRAM bit demand rises
Analysts at SEMI have confirmed a favorable outlook for DRAM as bit demand rises, bolstering selling prices in 2013 and 2014. “The DRAM sector experienced a sharp decline during the 2008/2009 financial crisis and subsequently contracted, both in the number of suppliers and in installed fab production capacity,” SEMI researchers explained in a recent press release.
Cyber attack shatters the digital-physical barrier
Writing for Wired, Kim Zetter reports that a recent cyber intrusion in Germany marked the second confirmed case in which a (wholly) digital attack caused physical destruction of equipment. “The first case, of course, was Stuxnet,” Zetter explained. “That attack was discovered in 2010 and since then experts have warned that it was only a matter of time before other destructive attacks would occur.”
The evolution of LPDDR4
Ajay Jain, a director of product marketing at Rambus, recently told Semiconductor Engineering that LPDDR3 was the “workhorse” of the mobile memory market in 2014. According to Jain, LPDDR3 will retain its heavyweight status throughout most of 2015 before it is supplanted by next-gen LPDDR4.
Lensless smart sensor technology is SWaP-C friendly
Writing for Military Embedded Systems, Amanda Harvey notes that stringent size, weight, power and cost (SWaP-C) requirements are influencing nearly every modern military platform. “Everything seems to be getting smaller in the U.S. military arsenal – whether it’s an unmanned aerial vehicle (UAV), an intelligence, surveillance, and reconnaissance (ISR) payload, or a handheld GPS device,” Harvey explained.
Tezzaron licenses Rambus ReRAM
Rambus and Tezzaron Semiconductor have clinched an agreement to incorporate Rambus oxide-resistive memory (ReRAM) technology in upcoming Tezzaron devices. According to Rambus Labs VP Gary Bronner, the architecture license grants Tezzaron access to system IP, specifications and validation suites to design differentiated chips using ReRAM.
