At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
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Memory Encryption Solutions for Protecting Data in Use
https://event.on24.com/wcc/r/3875499/91F76B7EC2D58CC3651EE345FE2C4EFD#new_tabThere are many challenges to achieving good “memory security,” especially in that the term “memory” could refer to on-chip SRAM, embedded non-volatile memory, or even off-chip memory (e.g., both DRAM or mass-storage non-volatile). We refer to data within non-executable NVM to be “data at rest,” while data within volatile memory like SRAM or DRAM to […]
DDR5 Memory Enables Next-Generation Servers
https://go.rambus.com/ddr5-memory-enables-next-generation-servers#new_tabAn exponential rise in data volume, and the rapid increase of advanced workloads like AI/ML training, requires constant innovation in all aspects of computing. Yet given the broad infrastructure implications, main memory technology changes infrequently, once every 6 or 7 years. The transition to DDR5 is a watershed industry event as it will be the main memory […]
LPDDR5 Delivers High Bandwidth for a Growing Range of Applications
https://go.rambus.com/lpddr5-delivers-high-bandwidth-for-a-growing-range-of-applications#new_tabInitially designed for mobile phones and laptops, the bandwidth and low power characteristics of LPDDR make it an increasingly attractive choice of memory for applications in IoT, automotive, edge computing and the data center. Fifth-generation LPDDR5 raises data rates to 6.4 Gbps and bandwidth to 25.6 GB/s for a x32 DRAM device. In this session, […]
Memory Bandwidth for AI/ML Races Higher with HBM3
https://go.rambus.com/rds-memory-bandwidth-races-higher-with-hbm3#new_tabWith the insatiable need for higher bandwidth in state-of-the-art AI/ML training and HPC, the HBM standard has been on a rapid pace of improvement. The newly standardized HBM3 generation doubles the data rate to 6.4 Gb/s that offers up to 819 GB/s of memory bandwidth between an accelerator and a single HBM3 DRAM device. Memory […]
CXL™ 3.0 Turns Up Scalability to 11
https://www.rambus.com/blogs/cxl-3-0-turns-up-scalability-to-11/The CXL™ Consortium (of which Rambus is a member) has now released the 3.0 specification of the Compute Express Link™ (CXL) standard. CXL 3.0 introduces compelling new features that promise to increase data center performance, scalability and TCO. CXL has evolved rapidly from its introduction in 2019. The 1.0/1.1 specification enabled prototyping of CXL solutions. […]
Rambus Reports Second Quarter 2022 Financial Results
https://www.rambus.com/second-quarter-2022-financial-results/Delivered Q2 revenue and earnings at the high end of guidance Achieved record quarterly product revenue driven by memory interface chips Expanded DDR5 portfolio with introduction of companion chips for server and client memory modules Generated $56.5 million in cash from operations SAN JOSE, Calif. – August 1, 2022– Rambus Inc. (NASDAQ:RMBS), a provider of […]
DDR5 Delivers More Bandwidth and Capacity with a Smarter DIMM
https://www.rambus.com/blogs/ddr5-delivers-more-bandwidth-and-capacity-with-a-smarter-dimm/The first wave of DDR5-based servers sport RDIMMs running at 4800 megatransfers per second (MT/s). This is a 50% increase in data rate over top-end 3200 MT/s DDR4 RDIMMs in previous generation high-performance servers. DDR5 memory incorporates a number of innovations, including Decision Feedback Equalization (DFE) and a new DIMM architecture, which enable that speed […]
Rambus Expands Portfolio of DDR5 Memory Interface Chips for Data Centers and PCs
https://www.rambus.com/rambus-expands-portfolio-of-ddr5-memory-interface-chips-for-data-centers-and-pcs/Highlights: Introduces SPD Hub and Temperature Sensor as part of server and client DDR5 memory module chipsets Complements industry-leading DDR5 RCD delivering state-of-the-art bandwidth and capacity Enables enhanced system management and thermal control for improved TCO SAN JOSE, Calif. – July 18, 2022 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and […]
Rambus Design Summit Interview Series: Steven Woo
https://www.rambus.com/blogs/rambus-design-summit-interview-series-steven-woo/Rambus Fellow, Steven Woo, returns to the Rambus Design Summit stage tomorrow, and we are so excited for his keynote: Advancing Computing in the Accelerator Age! In our last interview before the show, we met with Steven to chat about his background, CXL, and some of the biggest challenges for computing in the years ahead. Read […]
Rambus Completes Acquisition of Hardent
https://www.rambus.com/rambus-completes-acquisition-of-hardent/Strengthens CXL Memory Interconnect Initiative and accelerates roadmap of data center solutions SAN JOSE, Calif. – May 24, 2022 – Rambus Inc.(NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced the completion of the acquisition of Hardent, Inc. (“Hardent”), a leading SoC digital design company. CXL-based architectures will […]
