Jerome Nadel to talk smart cities @ MWC 2015

On March 3rd, Rambus CMO Jerome Nadel will participate in 4YFN’s MWC 2015 panel discussion about the Internet of Things (IoT), smart sensors and the evolution of smart cities.

Jerome Nadel to talk smart cities @ MWC 2015

On March 3rd, Rambus CMO Jerome Nadel will participate in 4YFN’s MWC 2015 panel discussion about the Internet of Things (IoT), smart sensors and the evolution of smart cities. Additional 4YFN panelists include Cisco CTO John Baekelmans, MLOVE Founder and Curator Harald Neidhardt, Intel Human Computer Interaction Expert Mara Balestrini and D4SC Designer-Founder Priya Prakash. […]

Mobile DRAM industry valued at over $3.6 billion

DRAMeXchange, a division of TrendForce, recently confirmed worldwide mobile DRAM revenue of US$3.607 billion in the fourth quarter of 2014 – representing 27.8% of DRAM industry value and a 4.2% quarterly increase. In addition, mobile DRAM made up nearly 40% of all DRAM shipments.

Mobile DRAM industry valued at over $3.6 billion

DRAMeXchange, a division of TrendForce, recently confirmed worldwide mobile DRAM revenue of US$3.607 billion in the fourth quarter of 2014 – representing 27.8% of DRAM industry value and a 4.2% quarterly increase. In addition, mobile DRAM made up nearly 40% of all DRAM shipments. According to DRAMeXchange assistant VP Avril Wu, mobile memory’s average selling […]

From GDDR to HBM

A recent KitGuru report suggests AMD has designed its upcoming Radeon R9 380X with high bandwidth memory, or HBM, a next-gen stacked DRAM memory standard. “Although HBM provides DDR3 – like bit rate per pin (HBM1=1GHz, HBM2=2GHz), the standard more than compensates with its channel of 128 bits each,” Loren Shalinsky, a Strategic Development Director […]

U.S. EMV Payments: PIN or Signature?

One of the longest ongoing discussions about EMV in the US is the card verification method (CVM) to authenticate EMV payments: PIN or signature?

From GDDR to HBM

A recent KitGuru report suggests AMD has designed its upcoming Radeon R9 380X with high bandwidth memory, or HBM, a next-gen stacked DRAM memory standard. Read first our primer on: HBM2E Implementation & Selection – The Ultimate Guide » “Although HBM provides DDR3 – like bit rate per pin (HBM1=1GHz, HBM2=2GHz), the standard more than […]

U.S. DoD eyes 3D printing

Writing for Military Embedded Systems, Editorial Director John McHale confirms 3D printing has made its way into the military embedded computing realm, with suppliers exploiting the technology to accelerate production and reduce development costs. “They can save thousands of dollars by printing heat sinks, connectors, components and even printed circuit boards,” he explained.

Workshop: Understanding Tokenization and Host Card Emulation

U.S. DoD eyes 3D printing

Writing for Military Embedded Systems, Editorial Director John McHale confirms 3D printing has made its way into the military embedded computing realm, with suppliers exploiting the technology to accelerate production and reduce development costs. “They can save thousands of dollars by printing heat sinks, connectors, components and even printed circuit boards,” he explained. “The Department […]