Join us at the AI Infra Summit! Stop by booth #1704 to chat with our team about our solutions. Additionally, Rambus Fellow, Steven Woo, along with Samsung Electronics’ CVP, Taeksang Song, will be speaking about the evolution of memory technologies and the challenges the industry faces for future AI chips and systems. Full abstract and session information below:
Memory/Storage: Challenges for Memory as AI Growth Accelerates
When: September 10th at 4:55 PM – 5:35 PM
Track: Hardware & Systems
Abstract: As the adoption of generative and agentic AI accelerates, the challenges for memory as a key enabler of AI/ML processing architectures continue to grow. Balancing the demands for ever greater bandwidth and capacity with the needs of power efficiency, thermal management and increased reliability is increasingly difficult. Continued advances in high performance HBM and GDDR memories, and mainstream DDR and LPDDR memories, remains a strategic industry imperative. In addition, a suite of new technologies including multiplexed modules (MRDIMM), CXL and processing in memory are needed to meet upcoming AI requirements. In this panel, we’ll discuss the evolution of memory technologies and the challenges the industry faces on the road ahead for future AI chips and systems.
To learn more and register, follow the link here: https://ai-infra-summit.com/events/ai-infra-summit
About AI Infra Summit
The AI Infra Summit is the world’s largest and most established AI conference that focuses on the infrastructure layer of AI & Machine Learning. Originating as the AI Hardware Summit back in 2018, the summit has evolved from a semiconductor conference into a full-stack AI infrastructure event. The 2025 summit will attract 3,500 attendees and over 100 partners, with content designed for hardware providers, hyperscalers, and all enterprise IT and AI infrastructure specialists building fast, efficient, and affordable AI.
