• Skip to primary navigation
  • Skip to main content
  • Skip to footer
  • English
  • Investor Relations
  • Resource Library
  • Newsroom
  • Blog
  • Careers
  • Support Center
Rambus Logo

Rambus

At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.

  • Products
      • All
          • Memory Interface Chips
          • DIMM Chipsets
          • DDR5 DIMM Chipset
          • DDR4 NVRCD
          • DDR4 Register Clock Driver
          • DDR4 Data Buffer
          • CXL Memory Interconnect Initiative
          • Interface IP
          • Memory PHYs
          • GDDR6 PHY
          • HBM3 PHY
          • HBM2E PHY
          • DDR4 PHY
          • More…
          • SerDes PHYs
          • PCIe 6.0 PHY
          • PCIe 5.0 PHY
          • 32G C2C PHY
          • 32G PHY
          • 28G PHY
          • More…
          • Digital Controllers
          • Memory Controllers
          • CXL & PCI Express Controllers
          • MIPI Controllers
          • Video Compression and Forward Error Correction Cores
          • Security IP
          • Root of Trust Solutions
          • Security Protocol Engines
          • Inline Cipher Engines
          • Crypto Accelerator Cores
          • DPA Countermeasures
          • Software Protocols & Crypto Toolkits
          • Anti-Counterfeiting
          • Provisioning and Key Management
      • Memory Interface Chips
        • DIMM Chipsets
          • DDR5 DIMM Chipset
          • Non-Volatile DDR4 Registering Clock Driver
          • DDR4 Register Clock Driver
          • DDR4 Data Buffer
          • DDR3 Register Clock Driver
          • DDR3 Isolation Memory Buffer
        • CXL Memory Interconnect Initiative

        • Made for high speed, reliability and power efficiency, our DDR3, DDR4, and DDR5 DIMM chipsets deliver top-of-the-line performance and capacity for the next wave of computing systems. Learn more about our Memory Interface Chip solutions
      • Interface IP
          • Memory PHYs
            • GDDR6 PHY
            • HBM3 PHY
            • HBM2E PHY
            • DDR4 PHY
            • DDR4 Multi-modal PHY
            • DDR3 PHY
          • SerDes PHYs
            • PCIe 6.0 PHY
            • PCIe 5.0 PHY
            • PCIe 4.0 PHY
            • 32G C2C PHY
            • 32G PHY
            • 28G PHY
            • 16G PHY
            • 12G PHY
            • 6G PHY
          • Digital Controllers
            • HBM3 Controller
            • HBM2E Controller
            • GDDR6 Controller
            • LPDDR5 Controller
            • CXL 2.0 Controller
            • PCIe 6.0 Controller
            • PCIe 5.0 Controller
            • MIPI CSI-2/DSI-2 Controllers
            • Video Compression and Forward Error Correction Cores
            • More…

        • With their reduced power consumption and industry-leading data rates, our line-up of memory interface IP solutions support a broad range of industry standards with improved margin and flexibility. Learn more about our Interface IP solutions
      • Security IP
          • Root of Trust Solutions
          • Security Protocol Engines
            • MACsec Engines
            • IPsec, TLS, SSL Multi-Protocol Engines
            • High Speed Public Key Accelerator
          • Inline Cipher Engines
          • Crypto Accelerator Cores
            • DPA Resistant Cores
            • Basic Crypto Blocks
          • Anti-Counterfeiting
            • CryptoFirewall Cores
            • Circuit Camouflage Technology
          • DPA Countermeasures
            • DPA Resistant Cores
            • DPA Resistant Software Libraries
            • DPA Workstation Platform
          • Software Protocols & Crypto Toolkits
            • IPsec Toolkit
            • FIPs Cryptographic Libraries
            • MACsec Toolkit
            • IoT Security Framework
          • CryptoMedia
            • Content Protection Core
            • Content Protection Services
          • Provisioning and Key Management
            • CryptoManager Provisioning
            • CryptoManager Device Key Management

        • From chip-to-cloud-to-crowd, Rambus secure silicon IP helps protect the world’s most valuable resource: data. Securing electronic systems at their hardware foundation, our embedded security solutions span areas including root of trust, tamper resistance, content protection and trusted provisioning. Learn more about our Security IP offerings
  • Markets
      • AI & Machine Learning
        • Speed and Security for the Artificial Intelligence & Machine Learning Revolution
          • Products
          • SerDes PHYs
          • Memory PHYs
          • Digital Controllers
          • Memory Interface Chips
          • Root of Trust
          • Crypto Accelerator Cores
          • Protocol Engines
          • Provisioning and Key Management
          • AI & Machine Learning
      • Automotive
        • Providing Performance & Security for the Connected Car
          • Products
          • Memory PHYs
          • SerDes PHYs
          • Digital Controllers
          • Root of Trust
          • PKE Engine
          • MACsec Engines
          • Crypto Accelerator Cores
          • Provisioning and Key Management
          • Explore Automotive
      • Data Center
        • Optimizing capacity, connectivity and capability of the cloud
          • Products
          • SerDes PHYs
          • Memory PHYs
          • Digital Controllers
          • Memory Interface Chips
          • Root of Trust
          • MACsec Engines
          • Software Protocols
          • Provisioning and Key Management
          • See Data Center
      • Edge
        • Catching a tidal wave of data
          • Products
          • Memory PHYs
          • SerDes PHYs
          • Digital Controllers
          • Root of Trust
          • Crypto Accelerator Cores
          • Protocol Engines
          • Software Protocols
          • Discover Edge
      • Government
        • Securing Mission-critical Systems
          • Products
          • Root of Trust
          • Protocol Engines
          • Anti-Tamper Cores
          • Provisioning and Key Management
          • DPA Workstation Platform
          • SerDes PHYs
          • Memory PHYs
          • Digital Controllers
          • See Government
      • IoT
        • Making IoT Data Safe & Fast
          • Products
          • Root of Trust
          • TLS Toolkits
          • Provisioning and Key Management
          • Memory PHYs
          • SerDes PHYs
          • Digital Controllers
          • Explore IoT
  • Resources
    • Inventions
    • Buying Guide
    • Resource Library
      • Webinars
      • Product Selector
  • About
      • Corporate Overview
      • Leadership
      • Inventors
      • Careers
      • Locations
      • Investor Relations
      • Newsroom
      • Blog
      • Events
      • Partnerships
      • Certifications
      • Corporate Responsibility
      • Contact
Home > Videos > ASICs Unlock Deep Learning Innovation: Webinar May 2, 2018

ASICs Unlock Deep Learning Innovation: Webinar May 2, 2018

Please join Samsung Electronics, Amkor, eSilicon and Northwest Logic as we present a complete implementation platform for deep learning ASICs

San Jose, Calif. — April 3, 2018 — Deep learning applications require extreme performance, low power and high efficiency to effectively process the massive amounts of data used in those applications. Many of these artificial intelligence (AI) related systems cannot be realized without the performance and security provided by an advanced application specific integrated circuit (ASIC).

Please join Samsung Electronics, Amkor Technology, eSilicon Corporation and Northwest Logic as we present a complete ASIC platform for deep learning applications. This platform includes high-bandwidth memory (HBM2), 2.5D system-in-package (SiP) design and implementation, HBM2 controllers, HBM2 PHY and memory IP in 14nm and 7nm FinFET process nodes. This webinar will be moderated by Dan Nenni, CEO and founder of SemiWiki.

Wednesday, May 2, 2018
8:00-9:00 AM and 6:00PM-7:00PM Pacific time
This webinar has concluded. 

Presentation Focuses

Dan Nenni: Overview of market
Samsung Electronics: HBM2 memory solutions
Amkor: Advanced packaging solutions
eSilicon: ASIC/2.5D design and enabling 7/14nm IP platforms (HBM2 PHY, SerDes, TCAM, custom memories)
Northwest Logic: HBM controller

About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI and Foundry. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com

About Amkor Technology, Inc.
Amkor Technology, Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operating base includes 10 million square feet of floor space, with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S.

About eSilicon
eSilicon is an independent provider of complex FinFET-class ASIC design, custom IP and advanced 2.5D packaging solutions. Our ASIC+IP synergies include complete, 2.5D/HBM2 and TCAM platforms for FinFET technology at 14/16/7nm as well as SerDes, specialized memory compilers and I/O libraries. Supported by patented knowledge base and optimization technology, eSilicon delivers a transparent, collaborative, flexible customer experience to serve the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets.

About Northwest Logic
Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express Solution (PCI Express 4.0/3.0/2.1/1.1 cores, DMA cores and drivers), Memory Interface Solution (HBM2, DDR4/3, LPDDR4), and MIPI Solution (CSI-2, DSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs.

###

eSilicon is a registered trademark, and the eSilicon logo is a trademark, of eSilicon Corporation. Other trademarks are the property of their respective owners, and are hereby recognized and acknowledged.

Contacts:
Sally Slemons
eSilicon Corporation
408-635-6409
sslemons@esilicon.com

Susan Cain
Cain Communications
408-393-4794
scain@caincom.com

Footer

About

  • Corporate Overview
  • Leadership
  • Careers
  • Locations
  • Investor Relations
  • News
  • Corporate Responsibility

Products

  • Memory PHYs
  • SerDes PHYs
  • Digital Controllers
  • Server DIMM Chipsets
  • Root of Trust Solutions
  • Provisioning and Key Management
  • Protocol Engines
  • Crypto Accelerator Cores
  • Software Protocols
  • DPA Countermeasures
  • Anti-Counterfeiting
  • CryptoMedia

Markets

  • AI & Machine Learning
  • Automotive
  • Data Center
  • Edge
  • Government
  • IoT
  • Pay TV

Resources

  • Resource Library
  • Webinars
  • Inventions
  • Buying Guide
  • Contact

Copyright © 2023 Rambus.com. All Rights Reserved. Privacy Policy | Trademark & Guidelines

  • Facebook icon
  • Twitter icon
  • YouTuve icon
  • LinkedIn icon
  • Blog icon