Rambus

At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.

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Understanding Dennard scaling

In 1974, Robert H. Dennard co-authored a now-famous paper for the IEEE Journal of Solid State Circuits. Essentially, Dennard and his engineering colleagues observed that as transistors are reduced in size, their power density stays constant. Meaning, power use stays in proportion with area, as both voltage and current scale (downward) with length.

According to Prof. Dr.-Ing. Christian Märtin Hochschule of the Faculty of Computer Science at Augsburg University of Applied Sciences, power in CMOS chips can be modeled as dscaling. Q is the number of transistors, f the operating frequency of the chip, C the capacitance, V the operating voltage and I, the leakage current.

Rambus Completes Acquisition of Inphi Memory Interconnect Business

SUNNYVALE, Calif. – August 4, 2016 – Rambus Inc. (NASDAQ:RMBS) today announced it has successfully completed the acquisition of all the assets of Inphi Memory Interconnect Business, including product inventory, customer contracts, supply chain agreements, and intellectual property. The closing purchase price for Inphi Memory Interconnect Business was $90 million in cash.

Rambus announced this acquisition in June to strengthen its market position for memory buffer chip products and execute on programs that meet the needs of the server, networking and data center market. With this acquisition, Rambus remains committed to deliver on existing customer contracts and continue the development of next-generation memory types.

To learn more about Rambus and the Memory and Interfaces division, visit rambus.com/memory-and-interfaces.

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About Rambus Memory and Interfaces Division (MID)

The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the mobile, connected device, and cloud computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and chip-to-chip interfaces, DRAM, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.

Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, software, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.

Note Regarding Forward-Looking Statements
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 as amended, including statements regarding the potential benefits and incorporation of the acquired technologies into the Rambus Memory and Interfaces division, growth opportunities of the buffer chip market, and the ability to strengthen the Rambus product offerings. These forward-looking statements are based on current expectations, estimates, assumptions and projections that are subject to change. Actual results may differ materially from the forward-looking statements due to a variety of factors including, but not limited to, risks and uncertainties described from time to time in Rambus’ annual report on Form 10-K, quarterly reports on Forms 10-Q and other periodic filings with the Securities and Exchange Commission. All forward-looking statements are made as of the date of this press release and Rambus does not undertake any obligation to update any forward-looking statements based on new developments or changes in expectations.

Security researchers hack automotive CAN network

White hat security researchers Charlie Miller and Chris Valasek have once again hacked a 2014 Jeep Cherokee, this time plugging a laptop directly into the vehicle’s CAN network via a port under the dashboard.

“Instead of merely compromising one of the so-called electronic control units or ECUs on a target car’s CAN network and using it to spoof messages to the car’s steering or brakes, they also attacked the ECU that sends legitimate commands to those components, which would otherwise contradict their malicious commands and prevent their attack,” explained Wired’s Whitney Curtis. “By putting that second ECU into ‘bootrom’ mode—the first step in updating the ECU’s firmware that a mechanic might use to fix a bug—they were able to paralyze that innocent ECU and send malicious commands to the target component without interference.”

Taking smartphone security to the next level

Asaf Ashkenazi, a senior director at Rambus’ security division, recently gave a keynote presentation about the future of mobile security at the Linley Group’s Mobile and Wearables Conference.

According to Ashkenzai, the demand for trusted applications on mobile devices has increased significantly in recent years.

“As the amount of valuable data stored and communicated across mobile devices continues to grow, the need for robust security solution becomes even more important,” he told conference participants.

EE Times takes a closer look at Rambus’ 14nm R+ DDR4 PHY

Gary Hilson of the EE Times has covered Rambus’ recent announcement about the development of its R+ DDR4 PHY on GLOBALFOUNDRIES 14nm LPP process. As the journalist notes, the silicon is the first production-ready 3200 Mbps DDR4 PHY available on GLOBALFOUNDRIES Inc.’s FX-14 ASIC platform using its power-performance optimized 14nm LPP process.

Rambus Aims DDR4 PHY at Data Centers

TORONTO – Rambus Inc. said it has developed the first production-ready 3200 Mbps DDR4 PHY available on Globalfoundries Inc.’s FX-14 ASIC platform using its power-performance optimized 14nm LPP process.

The Rambus R+ DDR4 PHY intellectual property uses Rambus’ proprietary R+ architecure, based on the DDR industry standard. The PHY is part of the Rambus’ suite of memory and SerDes interface offerings for networking and data center applications, said Frank Ferro, senior director of product management at Rambus. Meeting the performance and capacity demands of those segments are a heavy focus for the company, he said in a telephone interview with EE Times.

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